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Home > Page 254

Rambus Updates Second Quarter Guidance

Rambus Updates Second Quarter Guidance

SUNNYVALE, CALIFORNIA, UNITED STATES – 06/17/2013 – Rambus Inc. (Nasdaq:RMBS), the innovative technology solutions company, today updated its revenue guidance for the quarter ending June 30, 2013, narrowing the range to $56 million to $58 million from the initial range of $53 million to $58 million. In addition, subsequent to the Hynix settlement announced last week, the Company will be reversing a prior accrual included in operating expenses, related to previously awarded costs of $8 million in litigation expenses.

About Rambus Inc.
Rambus is the innovative technology solutions company that brings invention to market. Unleashing the intellectual power of our world-class engineers and scientists in a collaborative and synergistic way, Rambus invents, licenses and develops solutions that challenge and enable our customers to create the future. While best known for creating unsurpassed semiconductor memory architectures, Rambus is also developing world-changing products and services in security, advanced LED lighting and displays, and immersive mobile media. For additional information visit www.rambus.com.

Dr. Thomas Vogelsang of Rambus to Present at the International Image Sensor Workshop 2013

SUNNYVALE, CALIFORNIA, UNITED STATES – 06/13/2013

Who: Rambus Inc. (NASDAQ: RMBS)
Where: IISW 2013
Snowbird, Utah
When: June 12 – 16, 2013

Sunday, June 16, 2013

Title: “Overcoming the Full-Well Capacity Limit: High Dynamic Range Imaging Using Multi-Bit Temporal Oversampling and Conditional Reset”
2:20 p.m.
Thomas Vogelsang, Michael Guidash, Song Xue, Rambus

The dynamic range of current CMOS image sensors are limited by each pixel’s “full-well” capacity, which is the ability of the pixel to collect photo-electrons into a quantum well bucket during the exposure period. Binary pixels employ advanced oversampling methods where each pixel has an order of magnitude higher effective full-well capacity compared to conventional CMOS active pixels, resulting in images with a corresponding improvement in dynamic range.

During this presentation, Dr. Vogelsang will discuss the system design of the Rambus Binary Pixel technology, introduced earlier this year. Specifically, he will describe how the high dynamic range image sensor oversamples the incident light by using the ADC output at each sampling and resetting the pixel only if a threshold has been exceeded. Dr. Vogelsang will present results from an image sensor test-chip that demonstrates dynamic range extension by a factor of 14 compared to a conventional sensor in the same technology.

About Rambus Inc.
Rambus is the innovative technology solutions company that brings invention to market. Unleashing the intellectual power of our world-class engineers and scientists in a collaborative and synergistic way, Rambus invents, licenses and develops solutions that challenge and enable our customers to create the future. While best known for creating unsurpassed semiconductor memory architectures, Rambus is also developing world-changing products and services in security, advanced LED lighting and displays, and immersive mobile media.

Rambus and SK Hynix Sign Patent License Agreement

Agreement settles all outstanding disputes

SEOUL, KOREA and SUNNYVALE, CALIFORNIA, – 06/11/2013 — Rambus Inc. (NASDAQ:RMBS), the innovative technology solutions company, and SK Hynix, the world’s top tier memory semiconductor supplier, today announced they have signed a five-year patent license agreement for the use of Rambus memory-related patented innovations in SK Hynix semiconductor products and have also settled all outstanding claims. The agreement includes a license to certain DRAM products for payments of $12 million per quarter for the next five years. Other terms of the agreement are confidential.

“This is a milestone agreement for both companies that puts years of legal disputes behind us and gives us the opportunity for collaboration,” said Dr. Ron Black, president and chief executive officer at Rambus. “With this agreement, we can focus more on engaging with the industry as we work on future challenges where we can bring invention and value to the market with superior solutions and products.”

Rambus management will host a conference call today at 2:00pm PT to discuss this agreement and settlement. The call will be available online at investor.rambus.com. A replay will be available following the call on the Rambus Investor Relations website for one week at the following numbers: (855) 859-2056 (domestic) or (404) 537-3406 (international) with ID# 94783491.

About Rambus Inc.
Rambus is the innovative technology solutions company that brings invention to market. Unleashing the intellectual power of our world-class engineers and scientists in a collaborative and synergistic way, Rambus invents, licenses and develops solutions that challenge and enable our customers to create the future. While best known for creating unsurpassed semiconductor memory architectures, Rambus is also developing world-changing products and services in security, advanced LED lighting and displays, and immersive mobile media. Additional information is available at www.rambus.com.

About SK Hynix Inc.
SK Hynix Inc., Korea, is the world’s top tier semiconductor supplier offering Dynamic Random Access Memory chips (“DRAM”), Flash memory chips (“NAND Flash”) and CMOS Image Sensors (“CIS”) for a wide range of distinguished customers globally. The Company’s shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxemburg Stock Exchange. Further information about SK Hynix is available at www.skhynix.com.

Rambus Adds Color Temperature Change Capability to Family of Revolutionary LED Bulbs

In-lamp adjustment allows end users to choose color temperature with a turn of the dial

SUNNYVALE, CALIFORNIA, UNITED STATES – 06/10/2013 – Rambus Inc. (NASDAQ: RMBS), the innovative technology solutions company that brings invention to market, today introduced a revolutionary capability for in-lamp adjustment of color temperature in its LED-based PAR30 and BR30 bulbs. This technology development comes following the general release of the Rambus PAR30 and BR30 bulbs, and continues the company’s momentum in bringing its portfolio of LED bulbs to market.

Since LEDs are available in a series of color that cross the spectrum of white, there is a high degree of variation of color temperatures in lamps that are available to the consumer, making it difficult to blend new LED bulbs with existing lighting. With a simple turn of a dial on the bulb, this innovative technology cost effectively enables in-lamp color temperature change through the use of a remote phosphor and a color mixing light guide, without requiring additional LEDs or expensive multi-channel drivers.

The Rambus in-lamp color adjustment technology allows the end user to continuously adjust color temperature to create the desired environment, from cool white of 5,000 kelvin to warm white of 3,000 kelvin, and all points in between. In the commercial sector, this technology enables simplified SKU management and is scalable to meet changing needs. Retailers need only one bulb on the store shelf to cover all the different color options that consumers require.

“We are excited to add more revolutionary capabilities to our LED bulb product portfolio. The ability for the end user to control and update the color temperature of their bulbs is unique within the lighting industry,” said Jeffery Parker, president of the Lighting and Display Technology group at Rambus. “Whether it’s a consumer, distributor, store owner or facility manager, this new capability means users can purchase the bulb today without worrying about replacing it later if their color temperature needs change.”

Rambus is currently accepting commercial requests for its PAR30 and BR30 bulbs, which are expected to be generally available in Q3 of this year. For additional information on Rambus’ wide-range of lighting innovations, please visit: www.rambus.com/bulb.

About Rambus Inc.
Rambus is the innovative technology solutions company that brings invention to market. Unleashing the intellectual power of our world-class engineers and scientists in a collaborative and synergistic way, Rambus invents, licenses and develops solutions that challenge and enable our customers to create the future. While best known for creating unsurpassed semiconductor memory architectures, Rambus is also developing world-changing products and services in security, advanced LED lighting and displays, and immersive mobile media.

PCI Express 3.0 Solution passes PCI-SIG PCIe 3.0 Compliance Testing at First Official PCIe 3.0 Compliance Workshop

Beaverton, Oregon – June 5, 2013— Northwest Logic today announced that its PCI Express® (PCIe®) 3.0 solution, including the Expresso 3.0 Core (PCI Express 3.0 Controller Core) and Expresso DMA Core passed all Gold and Interoperability tests at the April 2013 PCI-SIG® Compliance Workshop.  This testing was done with 8 lanes running at 8 Gbit/s SERDES rates at the first official PCIe 3.0 compliance workshop.  See PCI-SIG Integrators List at https://www.pcisig.com/developers/compliance_program/integrators_list/pcie_3.0. 

“Our successful compliance testing further verifies that Northwest Logic’s PCI Express 3.0 solution provides a robust and proven platform for developing PCI Express 3.0/2.1/1.1 based products.  This solution is silicon-proven and available for both ASIC and FPGA platforms.” said Brian Daellenbach, President of Northwest Logic. 

The PCI-SIG is responsible for the development of PCI-related standards including PCI Express, PCI-X® and PCI®.  The PCI-SIG holds quarterly PCI Express Compliance Workshops where companies can compliance test their PCI Express products. The PCI Express Gold and Interoperability Compliance endpoint testing consists of:

  • Interoperability Testing with a range of motherboard and switch products
  • Physical Layer Testing using a high-performance oscilloscope
  • Data-Link and Transaction Layer Testing using the Agilent Protocol Test Card
  • Configuration Testing using configuration test software

      “We’re pleased Northwest Logic has passed PCIe 3.0 compliance testing with its PCIe 3.0 IP products which aid designers by reducing the risk and cost of developing PCIe 3.0 designs,” said Al Yanes, PCI-SIG President and Chairman. “Its PCIe 3.0 compliant products ensure protocol adherence and interoperability which contributes to the continued success of the PCI Express standard.”

At the same Compliance Workshop, Xilinx, Inc. also successfully tested its Kintex®-7 FPGAs with GTX transceivers for compliance with the Northwest Logic’s Expresso 3.0 Core.  Built on state-of-the-art 28nm HPL process technology, the Xilinx® 7 Series All Programmable FPGA family is a generation ahead with breakout performance, capacity, and system integration while optimizing price/performance/watt.

“As a distinguished Premier Member of the Xilinx Alliance Program, Northwest Logic worked closely with Xilinx to ensure their PCI Express cores and our FPGAs provide best-in-class PCI Express 3.0 performance and features,” stated Tom Feist, Senior Marketing Director of Design Methodology at Xilinx.  “In addition, because this PCI-SIG validation was completed on Xilinx’s GTX transceiver technology, this solution also extends to Virtex®-7 FPGAs and Zynq®-7000 All Programmable SoCs.”

 

Key advantages of Northwest Logic’s PCI Express 3.0 solution include:

  • Silicon Proven
  • Complete solution significantly reduces development risk, cost and schedule
  • Expresso DMA Core and Driver provides high-performance scatter-gather DMA support
  • Provided with a testbench including PHY models for quick, out-of-the-box simulation
  • Comprehensive FPGA and ASIC support
  • High-quality technical support
  • Customization and integration services available

 

About Northwest Logic

            Northwest Logic, founded in 1995 and located in Beaverton, Oregon, provides high-performance, silicon-proven, easy-to-use IP cores including high-performance PCI Express solution (PCI Express 3.0, 2.1 and 1.1 cores and drivers), Memory Interface Solution (DDR4/3/2, LPDDR3/2 SDRAM; RLDRAM 3/II), and MIPI Solution (CSI-2, DSI). These solutions support a full range of platforms including ASICs, Structured ASICs and FPGAs. For additional information, visit https://nwlogic.com.

###

PCI-SIG, PCI Express, PCIe, PCI-X and PCI are all trademarks or registered trademarks of PCI-SIG.  All trademarks are the property of their respective holder.

For more information contact:

Vinitha Seevaratnam
Northwest Logic
(503) 533-5800  x308
www.nwlogic.com

Mobile Payments: Why Secure Element in the Cloud?

Mobile Payments: Why Secure Element in the Cloud? from
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