U.S. Banks: Insource or Outsource EMV Data Preparation?
Rambus Announces Winners of the 2013 “Innovator of the Future” Scholarship Award
Scholarship program recognizes students for their passion in science and technology
SUNNYVALE, CALIFORNIA, UNITED STATES – 05/20/2013 – Rambus Inc. (Nasdaq:RMBS), the innovative technology solutions company, today announced that the Northern District of California (NDCA) has issued his ruling in the matter against SK hynix. The judgment by the Honorable Ronald M. Whyte recognizes the value of Rambus’ intellectual property, affirming previous findings that the Rambus patents involved in this case are valid and infringed by SK hynix.
In March 2009, the court entered a judgment and awarded Rambus $349 million after a remittitur plus prejudgment interest, and required SK hynix to pay specified royalties to Rambus on an ongoing basis until April 2010. The May 2013 ruling concludes that an amount of $250 million should be applied as a credit against the judgment. In addition, the ruling applied an effective royalty rate of between 0.80% and 0.85% of sales and denied all SK hynix motions for summary judgment and granted, in part, Rambus’ motion to amend the court’s findings of fact.
“We are pleased with the Honorable Judge Whyte’s ruling supporting reasonable compensation for the use of our patented inventions, but are disappointed with the sanction,” said Jae Kim, Rambus senior vice president and general counsel. “We appreciate the Court’s extensive efforts in this case and are hopeful this ruling will lead to putting this matter behind us.”
Rambus management will discuss this decision during a special conference call on Thursday, May 9, 2013 at 1:30 p.m. PT. The call will be webcast and can be accessed through the Rambus website. A replay will be available following the call on Rambus’ Investor Relations website.
About Rambus Inc.
Rambus is the innovative technology solutions company that brings invention to market. Unleashing the intellectual power of our world-class engineers and scientists in a collaborative and synergistic way, Rambus invents, licenses and develops solutions that challenge and enable our customers to create the future. While best known for creating unsurpassed semiconductor memory architectures, Rambus is also developing world-changing products and services in security, advanced LED lighting and displays, and immersive mobile media.
Rambus Engineers and Inventors to Present Three Papers at Electronic System Technologies Conference & Exhibition 2013
SUNNYVALE, CALIFORNIA, UNITED STATES and LAS VEGAS, NEVADA, – 05/20/2013
| Who: | Rambus Inc. (NASDAQ: RMBS) | |
| Where: | ESTC 2013 The New Tropicana 3801 S Las Vegas Blvd Las Vegas, NV 89109 |
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| When: | May 20-23, 2013 | |
At the Electronic System Technologies Conference and Exhibition (ESTC) 2013, Rambus engineers will present three technical papers in the areas of 3-D interposer design, high frequency effects in physical architectures, and high-speed parallel buses.
Tuesday, May 21, 2013
Title: “System Design of a Bufferless 6.4 Gb/s Server Multi-DIMM Memory Interface System”
8:00 a.m. – 12:00 p.m.
Yi Lu, Ravi Kollipara, and Arun Vaidyanath, Rambus
Rambus engineers will discuss details of the system design of a multi-DIMM memory interface system of 6.4 Gb/s data rate and 1.6 Gb/s C/A rate, showcasing innovations like fast power down exit and near ground signaling to reduce idle and active power consumption.
Title: “Consideration of Fiber Weave Effects in Selecting PCB Dielectric Material for 25/28 Gbps SerDes Applications”
8:00 a.m. – 12:00 p.m.
Gnanadeep Kollipara, David Secker, and Arun Vaidyanath, Rambus
In this paper presentation, Rambus engineers will demonstrate the impacts of the anisotropy of the fiber weave in one dielectric material by using identical strip line structures on a single fabricated PCB with traces at varying rotations.
Thursday, May 23, 2013
Title: “3-D Si Interposer Manufacturing and Design Challenges”
8:00 a.m. – 12:00 p.m.
Ming Li, Mandy Ji, Julia Cline, John Lau, Pei-Jer Tzeng, Chau-Jie Zhan, and Ching-Kuan Lee, Rambus
In this presentation, Rambus engineers will present a 3-D silicon interposer design with double-sided active silicon chip attachments. Design and manufacturing challenges as well as solutions and package structure will be discussed.
About Rambus Inc.
Rambus is the innovative technology solutions company that brings invention to market. Unleashing the intellectual power of our world-class engineers and scientists in a collaborative and synergistic way, Rambus invents, licenses and develops solutions that challenge and enable our customers to create the future. While best known for creating unsurpassed semiconductor memory architectures, Rambus is also developing world-changing products and services in security, advanced LED lighting and displays, and immersive mobile media.
Court Ruling in SK Hynix Matter Recognizes the Value of Rambus IP and Determines Sanction
SUNNYVALE, CALIFORNIA, UNITED STATES – 05/09/2013 – Rambus Inc. (Nasdaq:RMBS), the innovative technology solutions company, today announced that the Northern District of California (NDCA) has issued his ruling in the matter against SK hynix. The judgment by the Honorable Ronald M. Whyte recognizes the value of Rambus’ intellectual property, affirming previous findings that the Rambus patents involved in this case are valid and infringed by SK hynix.
In March 2009, the court entered a judgment and awarded Rambus $349 million after a remittitur plus prejudgment interest, and required SK hynix to pay specified royalties to Rambus on an ongoing basis until April 2010. The May 2013 ruling concludes that an amount of $250 million should be applied as a credit against the judgment. In addition, the ruling applied an effective royalty rate of between 0.80% and 0.85% of sales and denied all SK hynix motions for summary judgment and granted, in part, Rambus’ motion to amend the court’s findings of fact.
“We are pleased with the Honorable Judge Whyte’s ruling supporting reasonable compensation for the use of our patented inventions, but are disappointed with the sanction,” said Jae Kim, Rambus senior vice president and general counsel. “We appreciate the Court’s extensive efforts in this case and are hopeful this ruling will lead to putting this matter behind us.”
Rambus management will discuss this decision during a special conference call on Thursday, May 9, 2013 at 1:30 p.m. PT. The call will be webcast and can be accessed through the Rambus website. A replay will be available following the call on Rambus’ Investor Relations website.
About Rambus Inc.
Rambus is the innovative technology solutions company that brings invention to market. Unleashing the intellectual power of our world-class engineers and scientists in a collaborative and synergistic way, Rambus invents, licenses and develops solutions that challenge and enable our customers to create the future. While best known for creating unsurpassed semiconductor memory architectures, Rambus is also developing world-changing products and services in security, advanced LED lighting and displays, and immersive mobile media.
EMV in the U.S. – Can the Banks Meet the Deadlines?
Controllers Newsletter – Q2 2013
Northwest Logic’s PCI Express 3.0 solution certified at the first official PCI Express 3.0 Compliance Workshop!
Northwest Logic’s PCI Express 3.0 solution, including the Expresso 3.0 Core (PCIe 3.0 core) and Expresso DMA Core, in combination with the Xilinx Kintex-7 Board (KC705) passed all Gold and Interoperability tests at the April 2013 PCI-SIG Compliance Workshop resulting in its certification. This testing was done with 8 lanes running at 8 Gbit/s. See PCI-SIG Integrators List on www.pcisig.com.
This further confirms that Northwest Logic’s PCI Express 3.0 solution provides a robust and proven platform for developing PCI Express 3.0/2.1/1.1 based products. This solution is available for both ASIC and FPGA platforms.
DDR4 and LPDDR3 Support Released
Northwest Logic has expanded its comprehensive Memory Interface Solution to include DDR4 and LPDDR3 support. As a consequence, Northwest Logic is now delivering multi-mode controllers which include DDR4/3 and LPDDR3 support. These controllers are specifically designed to maximize bus efficiency and ease of use while minimizing latency and size.
MIPI FPGA Solution Using Meticom ICs
Low cost MIPI cameras and displays are now being widely used in cell phones and other products. As a result, there is a growing interest in supporting MIPI using FPGAs. Currently available FPGAs do not typically support MIPI natively. Northwest Logic’s family of CSI-2 and DSI Controller Cores now support a broad range of FPGA platforms using the Meticom FPGA Bridge ICs. Complete demonstration systems will be available in June.
DMA Core in Xilinx Artix-7 Evaluation Kit
The Xilinx Artix™-7 FPGA AC701 Evaluation Kit includes a full license to Northwest Logic’s AXI DMA Back-End Core as part of the connectivity reference design. This kit, fully available now, features the Artix-7 which supports low-power, cost-sensitive applications, includes a board, design tools, IP, and the pre-verified connectivity reference design. For more info go to: www.xilinx.com/products/boards-and-kits.html
