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Home > Page 256

Rambus Adds Color Temperature Change Capability to Family of Revolutionary LED Bulbs

Rambus Adds Color Temperature Change Capability to Family of Revolutionary LED Bulbs

In-lamp adjustment allows end users to choose color temperature with a turn of the dial

SUNNYVALE, CALIFORNIA, UNITED STATES – 06/10/2013 – Rambus Inc. (NASDAQ: RMBS), the innovative technology solutions company that brings invention to market, today introduced a revolutionary capability for in-lamp adjustment of color temperature in its LED-based PAR30 and BR30 bulbs. This technology development comes following the general release of the Rambus PAR30 and BR30 bulbs, and continues the company’s momentum in bringing its portfolio of LED bulbs to market.

Since LEDs are available in a series of color that cross the spectrum of white, there is a high degree of variation of color temperatures in lamps that are available to the consumer, making it difficult to blend new LED bulbs with existing lighting. With a simple turn of a dial on the bulb, this innovative technology cost effectively enables in-lamp color temperature change through the use of a remote phosphor and a color mixing light guide, without requiring additional LEDs or expensive multi-channel drivers.

The Rambus in-lamp color adjustment technology allows the end user to continuously adjust color temperature to create the desired environment, from cool white of 5,000 kelvin to warm white of 3,000 kelvin, and all points in between. In the commercial sector, this technology enables simplified SKU management and is scalable to meet changing needs. Retailers need only one bulb on the store shelf to cover all the different color options that consumers require.

“We are excited to add more revolutionary capabilities to our LED bulb product portfolio. The ability for the end user to control and update the color temperature of their bulbs is unique within the lighting industry,” said Jeffery Parker, president of the Lighting and Display Technology group at Rambus. “Whether it’s a consumer, distributor, store owner or facility manager, this new capability means users can purchase the bulb today without worrying about replacing it later if their color temperature needs change.”

Rambus is currently accepting commercial requests for its PAR30 and BR30 bulbs, which are expected to be generally available in Q3 of this year. For additional information on Rambus’ wide-range of lighting innovations, please visit: www.rambus.com/bulb.

About Rambus Inc.
Rambus is the innovative technology solutions company that brings invention to market. Unleashing the intellectual power of our world-class engineers and scientists in a collaborative and synergistic way, Rambus invents, licenses and develops solutions that challenge and enable our customers to create the future. While best known for creating unsurpassed semiconductor memory architectures, Rambus is also developing world-changing products and services in security, advanced LED lighting and displays, and immersive mobile media.

PCI Express 3.0 Solution passes PCI-SIG PCIe 3.0 Compliance Testing at First Official PCIe 3.0 Compliance Workshop

Beaverton, Oregon – June 5, 2013— Northwest Logic today announced that its PCI Express® (PCIe®) 3.0 solution, including the Expresso 3.0 Core (PCI Express 3.0 Controller Core) and Expresso DMA Core passed all Gold and Interoperability tests at the April 2013 PCI-SIG® Compliance Workshop.  This testing was done with 8 lanes running at 8 Gbit/s SERDES rates at the first official PCIe 3.0 compliance workshop.  See PCI-SIG Integrators List at https://www.pcisig.com/developers/compliance_program/integrators_list/pcie_3.0. 

“Our successful compliance testing further verifies that Northwest Logic’s PCI Express 3.0 solution provides a robust and proven platform for developing PCI Express 3.0/2.1/1.1 based products.  This solution is silicon-proven and available for both ASIC and FPGA platforms.” said Brian Daellenbach, President of Northwest Logic. 

The PCI-SIG is responsible for the development of PCI-related standards including PCI Express, PCI-X® and PCI®.  The PCI-SIG holds quarterly PCI Express Compliance Workshops where companies can compliance test their PCI Express products. The PCI Express Gold and Interoperability Compliance endpoint testing consists of:

  • Interoperability Testing with a range of motherboard and switch products
  • Physical Layer Testing using a high-performance oscilloscope
  • Data-Link and Transaction Layer Testing using the Agilent Protocol Test Card
  • Configuration Testing using configuration test software

      “We’re pleased Northwest Logic has passed PCIe 3.0 compliance testing with its PCIe 3.0 IP products which aid designers by reducing the risk and cost of developing PCIe 3.0 designs,” said Al Yanes, PCI-SIG President and Chairman. “Its PCIe 3.0 compliant products ensure protocol adherence and interoperability which contributes to the continued success of the PCI Express standard.”

At the same Compliance Workshop, Xilinx, Inc. also successfully tested its Kintex®-7 FPGAs with GTX transceivers for compliance with the Northwest Logic’s Expresso 3.0 Core.  Built on state-of-the-art 28nm HPL process technology, the Xilinx® 7 Series All Programmable FPGA family is a generation ahead with breakout performance, capacity, and system integration while optimizing price/performance/watt.

“As a distinguished Premier Member of the Xilinx Alliance Program, Northwest Logic worked closely with Xilinx to ensure their PCI Express cores and our FPGAs provide best-in-class PCI Express 3.0 performance and features,” stated Tom Feist, Senior Marketing Director of Design Methodology at Xilinx.  “In addition, because this PCI-SIG validation was completed on Xilinx’s GTX transceiver technology, this solution also extends to Virtex®-7 FPGAs and Zynq®-7000 All Programmable SoCs.”

 

Key advantages of Northwest Logic’s PCI Express 3.0 solution include:

  • Silicon Proven
  • Complete solution significantly reduces development risk, cost and schedule
  • Expresso DMA Core and Driver provides high-performance scatter-gather DMA support
  • Provided with a testbench including PHY models for quick, out-of-the-box simulation
  • Comprehensive FPGA and ASIC support
  • High-quality technical support
  • Customization and integration services available

 

About Northwest Logic

            Northwest Logic, founded in 1995 and located in Beaverton, Oregon, provides high-performance, silicon-proven, easy-to-use IP cores including high-performance PCI Express solution (PCI Express 3.0, 2.1 and 1.1 cores and drivers), Memory Interface Solution (DDR4/3/2, LPDDR3/2 SDRAM; RLDRAM 3/II), and MIPI Solution (CSI-2, DSI). These solutions support a full range of platforms including ASICs, Structured ASICs and FPGAs. For additional information, visit https://nwlogic.com.

###

PCI-SIG, PCI Express, PCIe, PCI-X and PCI are all trademarks or registered trademarks of PCI-SIG.  All trademarks are the property of their respective holder.

For more information contact:

Vinitha Seevaratnam
Northwest Logic
(503) 533-5800  x308
www.nwlogic.com

Mobile Payments: Why Secure Element in the Cloud?

Mobile Payments: Why Secure Element in the Cloud? from

Rambus Signs Comprehensive Agreement with STMicroelectronics

SUNNYVALE, CALIFORNIA, UNITED STATES – 06/17/2013 — Rambus Inc. (NASDAQ:RMBS), the innovative technology solutions company that brings invention to market, today announced it has signed a license agreement with STMicroelectronics (NYSE: STM). The agreement expands the ST relationship with CRI, furthering its adoption of DPA countermeasures into multimedia chipsets and accelerating its broad support for CryptoFirewall core technology.

In addition, the agreement provides ST with access to Rambus’ memory and interface technologies for inclusion in any ST products as well as exploration of further opportunities for collaboration. The companies have also settled all outstanding claims, including pending disputes related to Rambus’ patented innovations.

“We are pleased to have reached this agreement with ST, a global leader in the semiconductor industry,” said Dr. Ron Black, president and chief executive officer, Rambus. “Covering multiple Rambus divisions, this agreement exemplifies our ability to add value across ST’s product lines, and we look forward to ongoing collaboration with the ST team.”

As a result of the agreement, ST will expand deployment of CRI’s differential power analysis (DPA) countermeasures and CryptoFirewall security core technology across a wide range of its semiconductor products. The agreement also covers the use of Rambus’ patented memory interface and serial link innovations. Additionally, Rambus will have access to ST’s Fully Depleted Silicon On Insulator (FD-SOI) process technology design environment, enabling Rambus to benefit from reduced silicon geometries and lower power consumption at 28nm and below in its future Memory and Interface solutions.

Other terms of the agreement are confidential.

About Rambus Inc.
Rambus is the innovative technology solutions company that brings invention to market. Unleashing the intellectual power of our world-class engineers and scientists in a collaborative and synergistic way, Rambus invents, licenses and develops solutions that challenge and enable our customers to create the future. While best known for creating unsurpassed semiconductor memory architectures, Rambus is also developing world-changing products and services in security, advanced LED lighting and displays, and immersive mobile media. Additional information is available at rambus.com.

Rambus Ecebs receives new ITSO certification for its latest Contactless & Dual Interface Smart Cards

June 2013

– New cards can provide unrivalled ITSO product storage capability

Rambus Ecebs have been awarded ITSO certification for two members of its card family “Pearl” and “Diamond”.
Pearl, a contactless only smart card can hold at least twice as many ITSO products as the contactless platform (DESFire) and is therefore capable of holding tickets with a higher need for info storage such as those found on rail where customers may make multi-leg journeys or hold seat reservation information. The silicon platform for the Pearl card is provided by Infineon technologies.  It is a highly secure device used widely in the banking industry, which makes the Pearl card a secure choice for online transactions such as those used in ITSO part 11 implementations like Rambus Ecebs Paragon RTD solution. Security is especially relevant for high value transactions.

The Diamond card, which has also received its ITSO certificate, provides a ‘one size fits all’ card offering. This card offers all of the features provided by the Pearl card including the Infineon platform but as a dual interface device also comes with an EMV payment application meaning it can be used in schemes which are both ITSO and EMV based. The Diamond card is being used by a number of Rambus Ecebs customers including Nevis Technologies for the Glasgow Subway, which is due to go live during 2013. Both cards come with MIFARE legacy support and also have significant card memory left over to offer even more ITSO application space if required in addition to a wide range of additional applications such as Lasseo, ID, loyalty etc.

Both cards can be remotely updated, meaning changes required after the cards have been issued can be made, maximising the potential of the card post issuance.

Russell McCullagh, Rambus Ecebs Managing Director added, “with Pearl we have brought a card to market that will avoid a customer’s card running out of space to store their products. As more and more smart card transport schemes emerge and more commercial products are available, this will provide consumers with a better customer experience. With Diamond we have also added EMV payment meaning the card can be used on a wider basis, creating a wider appeal and experience for the travelling public.”

Bell ID Launches Secure Element in the Cloud

New solution reduces the complexities and cost of delivering mobile NFC services

Global provider of token management software, Bell ID, has launched Secure Element (SE) in the Cloud to simplify the provisioning of near-field-communication (NFC) based mobile services. The solution manages keys, certificates and NFC credentials in a secure remote environment rather than in the mobile device, providing application issuers with the independence and control to manage their credentials without the need for third party involvement.

Bell ID’s SE in the Cloud software has already been commercially deployed. It provides the functionality to complete (EMV payment) transactions through a remote SE using a standard contactless terminal and acceptance infrastructure. When a consumer makes a transaction, their NFC credential is accessed from the remote cloud SE after which the appropriate command is generated and sent back through the mobile device to the point-of-sale terminal. The data is presented in the same format as that used in standard card-present transactions. The solution can also pre-authorize payments, allowing consumers to make transactions even when a connection to the server cannot be established.

David Orme, CEO at Bell ID, comments: “By moving the SE from a physical device to a remote environment, application issuers are able to directly provision their applications to an SE. This enables them to take full control of their relationship with the customer and ensure a consistent brand and user experience across all available channels and services.”

The direct access offered by the new software to the SE also supports instant fraud detection and allows immediate blocking of an application when necessary. Additionally, having the SE in the cloud increases computing power and storage in comparison to a physical SE. This provides more options regarding advanced on-device risk management, as well as the ability to support virtually any number of NFC services.

Pat Curran, Executive Chairman at Bell ID, concludes: “With our SE in the Cloud software, we offer an easy, affordable and flexible alternative to the complex deployment models used in today’s NFC marketplace. This makes mobile NFC services accessible to a much wider audience, including banks, service providers, mobile network operators, payment processors and card personalization bureaus. We believe this is the next breakthrough in the adoption of mobile NFC services, which is already proven by the high demand for this solution from our customer base.”

For more information, please visit our Secure Element in the Cloud page.

 

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