Ground-breaking memory technology recognized in Digital SOC IP category
Los Altos, California, United States – 04/04/2006
Rambus Inc. (Nasdaq:RMBS), one of the world’s premier technology licensing companies specializing in high-speed chip interfaces, today announced that its memory performance-enhancing Dynamic Point-to-Point (DPP) technology has been recognized by industry publication EDN Magazine as the Innovation of the Year in the Digital SOC IP category. DPP received the prestigious honor at an awards gala held last night in San Jose.
“Innovation has always been at the core of Rambus, and we are constantly working to advance chip and system performance for high-speed applications,” said Rich Perego, principal architect of the XDR™ DRAM program at Rambus. “This award recognizes the work of many talented Rambus engineers, and we are proud to be honored by EDN.”
According to EDN Editor-in-Chief Maury Wright, “As our winners demonstrate again this year, innovation is evident everywhere from components and ICs to software and the most complex test gear. I feel privileged to work in electronics and witness engineers that are perpetually driven to innovate. It is their determination and creativity that we honor when we choose the best of the best to take home EDN Innovation award.”
First demonstrated on XDR™ memory systems in 2004, Rambus’ patented DPP technology is a unique innovation that enables uncompromising data rates in computing, networking and consumer systems. When applied to memory modules, DPP allows users to operate their memory systems at the maximum speed of a point-to-point topology while retaining the flexibility of high capacity and module upgrades. DPP technology is currently supported by XDR™ DRAM and XDR™2 DRAM, and with modifications to existing memories and controllers, can be applied to additional types of memory technologies, including DDR SDRAM and DDR2 SDRAM. For additional information on this and other Rambus innovations, please visit www.rambus.com/innovations.
About Rambus Inc.
Rambus is one of the world’s premier technology licensing companies specializing in the invention and design of high-speed chip interfaces. Since its founding in 1990, the company’s patented innovations, breakthrough technologies and renowned integration expertise have helped industry-leading chip and system companies bring superior products to market. Rambus’ technology and products solve customers’ most complex chip and system-level interface challenges enabling unprecedented performance in computing, communications and consumer electronics applications. Rambus licenses both its world-class patent portfolio as well as its family of leadership and industry-standard interface products. Headquartered in Los Altos, California, Rambus has regional offices in North Carolina, India, Germany, Japan and Taiwan. Additional information is available at www.rambus.com.
Note to Editors: The Rambus XDR™ DRAM device is a high-speed memory IC that turbo charges standard CMOS DRAM cores with a high-speed interface capable of 3.2 and 4.0 GHz data rates with a roadmap to 4.8, 6.4, and 8.0 GHz.