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At Rambus, we create cutting-edge semiconductor and IP products, spanning memory and interfaces to security, smart sensors and lighting.

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Recent Press Releases

Rambus Announces Comprehensive PCI Express 5.0 Interface Solution

November 12, 2019

Highlights: Integrated and optimized PHY and digital controller solution enables high-bandwidth and low-latency connectivity for next-generation applications in artificial intelligence (AI), data center, high-performance computing (HPC), enterprise and cloud storage, and 400GbE networking PHY supports both PCIe as well Compute Express Link (CXL) connectivity between host processor and workload accelerators for heterogenous computing Delivers superior power, performance and area on advanced 7nm FinFET process node SUNNYVALE, Calif. – Nov. 12, 2019 – Rambus Inc. (NASDAQ: RMBS), a premier silicon IP and chip

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Rambus Announces Comprehensive PCI Express 5.0 Interface Solution

November 12, 2019

Highlights:  Integrated and optimized PHY and digital controller solution enables high-bandwidth and low-latency connectivity for next-generation applications in artificial intelligence (AI), data center, high-performance computing (HPC), enterprise and cloud storage, and 400GbE networking PHY supports both PCIe as well Compute Express Link (CXL) connectivity between host processor and workload accelerators for heterogenous computing Delivers superior power, performance and area on advanced 7nm FinFET process node SUNNYVALE, Calif. – Nov. 12, 2019 – Rambus Inc. (NASDAQ: RMBS), a premier silicon IP and chip

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Rambus Reports Third Quarter 2019 Financial Results

November 4, 2019

Great quarter, exceeding expectations; GAAP revenue of $57.4 million; licensing billings of $63.1 million, product revenue of $21.4 million, and contract and other revenue of $16.6 million $25.6 million in cash provided by operating activities Refocused business on semiconductor with completed sale of payments and ticketing business to Visa Expanded silicon IP offerings with acquisition of digital controller IP provider, Northwest Logic, and agreement to acquire silicon IP and secure protocols businesses from Verimatrix Second consecutive quarter of record revenue

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Rambus Achieves Industry-Leading GDDR6 Performance at 18 Gbps

October 31, 2019

Highlights: Rambus GDDR6 Memory PHY has achieved the industry’s highest 18 Gbps performance Leading-edge memory PHY IP is four-to-five times faster than current DDR4 solutions Offers a complete and optimized memory subsystem of a GDDR6 PHY and a fully-integrated and verified memory controller Rambus GDDR6 is well suited for artificial intelligence (AI), machine learning (ML), data center, networking and autonomous driving systems that need higher bandwidth memory Rambus GDDR6 18 Gbps Transmit Eye SUNNYVALE, Calif. – Oct. 30, 2019 –Rambus Inc. (NASDAQ: RMBS),

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Rambus Achieves Industry-Leading GDDR6 Performance at 18 Gbps

October 30, 2019

Highlights:  Rambus GDDR6 Memory PHY has achieved the industry’s highest 18 Gbps performance Leading-edge memory PHY IP is four-to-five times faster than current DDR4 solutions Offers a complete and optimized memory subsystem of a GDDR6 PHY and a fully-integrated and verified memory controller Rambus GDDR6 is well suited for artificial intelligence (AI), machine learning (ML), data center, networking and autonomous driving systems that need higher bandwidth memory Rambus GDDR6 18 Gbps Transmit Eye SUNNYVALE, Calif. – Oct. 30, 2019 –Rambus Inc. (NASDAQ:

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Dr. Necip Sayiner Joins Rambus Board of Directors

October 25, 2019

Industry leader brings extensive semiconductor leadership and engineering experience SUNNYVALE, Calif. — Oct. 25, 2019 — Rambus Inc. (NASDAQ: RMBS), a premier silicon IP and chip provider dedicated to delivering data faster and safer, today announced the appointment of Dr. Necip Sayiner to its Board of Directors, effective immediately. With over twenty-five years of semiconductor expertise, Dr. Sayiner is an experienced executive with a proven track record of successfully increasing company revenue growth and profitability. Prior to joining the Rambus

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Rambus Closes Sale of Payments and Ticketing Businesses to Visa

October 22, 2019

For more information, please visit Visa here. Divestiture reinforces Rambus’ focus on core strength in semiconductor and accelerated growth in silicon IP and chips SUNNYVALE, Calif. – Oct. 22, 2019 – Rambus (NASDAQ: RMBS), a premier silicon IP and chip provider dedicated to delivering data faster and safer, today announced the completion of the previously-announced sale of its Payments and Ticketing businesses to Visa (NYSE: V). “With 30 years of experience pushing the envelope in semiconductor design, we look toward

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SEAKR Selects Rambus SerDes and Security IP for Aerospace and Satellite Communications

October 16, 2019

Highlights: SEAKR chooses Rambus 28G Multi-protocol long reach (LR) SerDes PHY and CryptoManager Root of Trust for aerospace and satellite communications Combined SerDes and Security IP portfolio offers a one-stop-shop for chip designers, making data faster and safer Silicon-proven technologies help enable faster, more secure, mission-critical aerospace electronic systems SUNNYVALE, CA, and CENTENNIAL, CO – October 16, 2019 – Rambus Inc. (NASDAQ: RMBS), a premier silicon IP and chip provider making data faster and safer, today announced that SEAKR® Engineering, a

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Rambus Tapes Out 112G XSR SerDes PHY on Leading-edge 7nm Process

September 25, 2019

Highlights: Provides critical building block to deliver data for next-generation data center, networking, high-performance computing (HPC), artificial intelligence (AI) and machine learning (ML) applications Delivers superior power, performance and area (PPA) for extra short reach (XSR) links with innovative architecture designed for leading-edge 7nm process node Expands SerDes PHY portfolio for 112G OIF-CEI industry standard SUNNYVALE, Calif. – Sep. 25, 2019 – Rambus Inc. (NASDAQ: RMBS), a premier silicon IP and chip provider making data faster and safer, today announced the tapeout of

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Rambus Announces Portfolio of Advanced Memory and SerDes PHYs on TSMC N7 Process

September 23, 2019

Highlights: GDDR6, HBM2, and 112G Long Reach (LR) interfaces designed for TSMC’s industry-leading N7 process technology expand Rambus’ leading-edge memory and SerDes PHY offerings Portfolio enables critical building blocks for next-generation data center, networking, wireless 5G, high-performance computing (HPC), advanced driver assistance systems (ADAS), artificial intelligence (AI) and machine learning (ML) applications SUNNYVALE, Calif. and SANTA CLARA, Calif. – Sep. 23, 2019 – Rambus Inc. (NASDAQ: RMBS), a premier silicon IP and chip provider making data faster and safer, today announced a broad

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