Media Alerts

San Francisco, California, United States – 03/07/2006

Who:  Rambus Inc. (Nasdaq:RMBS)

Where: Intel Developer Forum – Spring 2006

Booth # 609

Moscone Convention Center

San Francisco, CA. USA

When:March 7-9, 2006

At IDF Spring, Rambus will showcase its high-speed chip interface products, featuring demos and displays on:

• Rambus’ XDR™ DRAM devices along with an example of the first product implementation of XDR DRAM, a Cell processor-based blade server from Mercury Computer Systems, Inc. using 1 gigabyte of XDR DRAM. The Mercury Dual Cell-Based Blade features two IBM Cell BE (Broadband Engine) processors directly mounted on the board and XDR memory. Scalable to seven blades in a 7U configuration, the Dual Cell-Based Blade is expected to provide up to 2.8 teraFLOPS of processing performance in a 7U form factor, and up to 16 teraFLOPS in a six-foot rack.
• Rambus’ DDR technology performing memory transactions to and from a DDR2 device operating at 800Mbps (400MHz clock).
• Rambus’ PCI Express* PHY and Digital Controller Core.
• Rambus customer PLX Technology will demonstrate their PCI Express Switch PEX 8518 running video through a PCI Express based graphics card.

* PCI Express is a trademark of PCI-SIG. Brands, product names and marks are trademarks, registered trademarks, or trade names of their respective owners.

Taipei, Taiwan – 10/25/2005

Who: Rambus Inc. (Nasdaq:RMBS)
Where: Grand Hyatt – Taipei, Taiwan
When: October 27, 2005

Rambus
Developer Forum Taiwan is the premier event to learn about high-speed
memory and logic interfaces. Experts from leading global foundry,
semiconductor and system companies will discuss the latest technology
roadmaps, chip design, system implementation challenges, and test and
verification techniques.

Morning keynotes include:
· Sharon Holt, Senior VP, Worldwide Sales, Licensing and Marketing, Rambus
· John Cheng, VP of Marketing, ULi Corp
· Eddy Huang, VP of R&D, XGI Technology
· Nalin Balan, Denali Software
· Jean-Marc Patenaude, Director of Product Marketing, Rambus

Afternoon Track 1: Memory
Speakers
from Rambus and Agilent Technologies will cover the latest
technologies, applications and trends for DDR, DDR2, GDDR, and XDR™
DRAM.

Afternoon Track 2: PCI Express*
Speakers from
Rambus, Intel, Denali, and Tektronix will discuss the roadmap for the
PCI Express specification as well as design implementation, validation,
and measurement techniques.

Product demonstrations will also
be on display for attendees to see the latest Rambus innovations in
action. For more event details, please visit:
http://www.rambus.com/events.

Los Altos, California, United States – 10/11/2005

Who: Rambus Inc. (Nasdaq:RMBS)
When: October 12-13, 2005
Where: Westin Hotel, 5101 Great America Parkway, Santa Clara, CA 95054
What: Denali MemCon San Jose 2005

Join Rambus at Denali MemCon San Jose 2005 for a panel session and discussion on the need for advanced memory and serial interface technology and the application benefits of these high-speed interface solutions.

Wednesday, October 12
10:45am – 11:15am
Title: Memory Technology Trends and Solutions for the Future
Presenter: Victor Echevarria, Product Marketing Manager – Platform Solutions Group

Wednesday, October 12
1:15pm – 2:15pm
Title: Designing Off the PC DRAM Roadmap
Panelist: Victor Echevarria, Product Marketing Manager – Platform Solutions Group

Thursday, October 13
10:15am – 10:45am
Title: PCI Express Implementation Challenges
Presenter: Prakash Bare, General Manager of Digital Intellectual Property Business

For registration and additional information, please visit http://www.denali.com/memcon/.

About Denali MemCon

MemCon is the industry’s leading forum for exchanging leading-edge information on tools, technology, and product roadmaps for memory, storage, and other semiconductor interface standards. This year, MemCon San Jose is expected draw 1,500 attendees for the two-day event featuring over 40 exclusive presentations and panel sessions from industry experts in memory, storage, and serial interface technology.

Los Altos, California, United States
– 08/23/2005

Who: Rambus Inc. (Nasdaq:RMBS)

Where: Intel Developer Forum

Booth # 609

Moscone Convention Center West

San Francisco, CA. USA

When: August 23 – 25, 2005

At IDF, Rambus will showcase a number of its high-speed chip interface solutions, including its DDR2 PHY designs and its XDR™ memory interface solution with data rates ranging from 3.2-8.0 GHz.

In addition, Rambus and its partners will demonstrate and display its serial link interface products in key application areas:

• Advanced Switching and Servers – Rambus will showcase its partners PLX Technologies, IDT and Stargen solutions using its PCI Express* PHY;
• PC Graphics – Rambus PCI Express PHY customer boards from XGi and S3 will
  be on display;
• PC Motherboards – Rambus will showcase the Rambus PCI Express PHY
  incorporated into ULi’s chipset solution;
• Storage – Qlogic will be demonstrating its Fibre Channel adapter that uses
  Rambus’ PCI Express digital controller

Rambus’ integrated PCI Express solution, incorporating both digital controller and PHY technologies, will also be on display, demonstrating how an integrated solution can help reduce third-party vendor IP issues and speed time to market.

Rambus will also show its PCI Express PHYs passing the PCI Express Base 1.1 electrical compliance tests using the Tektronix TDS6154C Digital Storage Oscilloscope with RTEye™ PCI Express compliance test software.

* PCI Express is a trademark of PCI-SIG. Brands, product names and marks are trademarks, registered trademarks, or trade names of their respective owners.