Rambus

At Rambus, we create cutting-edge semiconductor and IP products, spanning memory and interfaces to security, smart sensors and lighting.

Home > Press Releases > Corporate > Media Alerts > Page 2

Media Alerts

Rambus to Present at MLOVE ConFestival

MLOVE ConFestival, Berlin, Germany – June 25, 2014

Who: Rambus Inc. (NASDAQ:RMBS)
Where: MLOVE ConFestival 2014
Schloss Beesenstedt, Germany
When: June 25–27, 2014

At the fifth annual MLOVE ConFestival taking place in Berlin, Germany, Rambus Chief Marketing Officer Jerome Nadel will discuss the Internet of Things architecture during the “Smart City and Internet of Things” panel, specifically addressing how to apply contrarian thinking and approaches to problem-solving. In addition, Nadel will be a judge in the Smart City and the Internet of Things competition, as well as an advisor during the Design Thinking workshops. Described by Wired magazine as the “Best Event for Mobile,” this year’s festival will focus on major themes including the Internet of Things, Wearables, Smart Cities and the Maker Movement.

CLICK TO TWEET: Jerome Nadel of @rambusinc to present on #IoT architecture and #smartcities at the @mlove ConFestival this week.#MLOVE14

Presentation

Title: Smart City and Internet of Thingsg
Date: Thursday, June 26, 2014
Time: 16:30 – 18:00 p.m.
Location: Castle Ballroom

About Rambus Inc.

Rambus brings invention to market. Our customizable IP cores, architecture licenses, tools, services, and training improve the competitive advantage of our customer’s products while accelerating their time-to-market. Rambus products and innovations capture, secure and move data. For more information, visit rambus.com.

Rambus to Present at the 2014 Computational Optical Sensing and Imaging Meeting

COSI, Kohala Coast, HI – June 23, 2014

Who: Rambus Inc. (NASDAQ:RMBS)
Where: Computational Optical Sensing and Imaging (COSI) 2014
The Fairmont Orchid
Kohala Coast, HI
When: June 24, 2014

Rambus inventors will lead three sessions at the Computational Optical Sensing and Imaging (COSI) Conference taking place in Kohala Coast, Hawaii on June 24, 2014. Drs. David Stork and Patrick Gill will discuss ultra-miniature diffractive computational sensing and imaging, specifically touching on the Rambus Lensless Smart Sensor technology. The conference, which focuses on the latest advances in the fields of imaging and sensing for medical, defense, homeland security, inspection and testing applications, explores both theoretical and experimental progress in computational optical sensing and imaging research. For additional details, visit: rambus.com.

Rambus Presentations

Title: Joint Optics/signal Processing Co-design for Diffractive Computational Sensing and Imaging
Presenter: David G. Stork, Rambus
Time: 2:30 p.m. HST
Location: Plaza Ballroom I & II

Title: Hardware Verification of an Ultra-miniature Computational Diffractive Imager
Presenters: Patrick R. Gill, David G. Stork, Rambus
Time: 3:15 p.m. HST
Location: Plaza Ballroom I & II

Title: Reading QR Code Symbols with an Ultra-miniature Computational Diffractive Imager
Presenters: David G. Stork, Patrick R. Gill, Rambus
Time: 3:30 p.m. HST
Location: Plaza Ballroom I & II

About Rambus Inc.

Rambus brings invention to market. Our customizable IP cores, architecture licenses, tools, services, and training improve the competitive advantage of our customer’s products while accelerating their time-to-market. Rambus products and innovations capture, secure and move data. For more information, visit rambus.com.

Rambus to Exhibit and Speak at the Design Automation Conference (DAC)

SUNNYVALE, Calif. – May 30, 2014

Who: Rambus Inc. (NASDAQ:RMBS)
Where: Design Automation Conference (DAC)
Moscone Center
San Francisco, Calif.
170 Market Street, San Jose, Calif.
www.dac.com
When: June 1 – 5, 2014

Rambus will take part in multiple talks at the Design Automation Conference (DAC) 2014, the premier conference for design and automation of electronic systems, discussing low-power, high-performance mobile memory systems. In addition, Rambus is exhibiting at DAC in the ARM Connected Community Pavilion (Booth #2001). For additional details, visit: rambus.com.

Rambus Presentations

Monday, June 2, 2014
Title: Low-power, high-performance mobile memory systems
Speaker: Frank Ferro, Senior Director, Memory and Interface Division, Rambus
Time: 11:35 a.m.
Location: ARM Theater, booth #2001

Title: Rambus Q&A with eSilicon
Speaker: Frank Ferro, Senior Director, Memory and Interface Division, Rambus
Time: 4:30 p.m.
Location: eSilicon Partner Theater, booth #512

Tuesday, June 3, 2014
Title: Rambus Q&A with eSilicon
Speaker: Herb Gebhart, Vice President, Memory and Interface Division, Rambus
Time: 12:30 p.m.
Location: eSilicon Partner Theater, booth #512

Wednesday, June 4
Title: Low-power, high-performance mobile memory systems
Speaker: Frank Ferro, Senior Director, Memory and Interface Division, Rambus
Time: 11:15 a.m.
Location: ARM Theater, booth #2001

Title: Rambus Q&A with eSilicon
Speaker: Joe Gullo, Senior Director, Alliances, Rambus
Time: 1:30 p.m.
Location: eSilicon Partner Theater, booth #512

Thursday, June 5
Title: Cryptography + Embedded Security: Crisis and Opportunity
Speaker: Paul Kocher, President CRI division, Rambus
Time: 11:30 a.m.
Location: Moscone, room 309

About Rambus Inc.

Rambus brings invention to market. Our customizable IP cores, architecture licenses, tools, services, and training improve the competitive advantage of our customer’s products while accelerating their time-to-market. Rambus products and innovations capture, secure and move data. For more information, visit rambus.com.

Cryptography Research to Keynote Secure Semiconductor Technology Workshop

SUNNYVALE, Calif. – May 21, 2014

Who: Cryptography Research, Inc., a division of Rambus (NASDAQ:RMBS)
Where: Secure, Trustworthy, Assured and Resilient Semiconductors
and Systems (STARSS) Workshop
Fairmont Hotel, Gold Room
170 Market Street, San Jose, Calif.
https://www.src.org/program/grc/t3s/
When: May 22, 2014

Benjamin Jun, chief technology officer of Cryptography Research Inc., a division of Rambus, will deliver keynote remarks on May 22 at the Secure, Trustworthy, Assured and Resilient Semiconductors and Systems (STARSS) workshop taking place in San Jose, California. The STARSS workshop convenes experts from industry, academia and government to discuss secure semiconductor technology and identify research to improve the characteristics of semiconductor technology without unduly impacting cost or performance.

In addition to delivering the keynote on security challenges and why hardware matters, Jun will also moderate a panel titled “Motivation for Action: What are the threats? What are the risks? What are the strategies for mitigation?” as part of the conference.

About Cryptography Research

Cryptography Research, Inc. (CRI), a division of Rambus Inc. (NASDAQ:RMBS), is a leader in semiconductor security research and development. Established by internationally renowned cryptographer Paul Kocher, CRI develops and licenses innovative technologies in areas including tamper resistance, content protection, anti-counterfeiting, network security, and financial services. Over seven billion security products are made each year under license from CRI. Security systems designed by CRI scientists and engineers protect hundreds of billions of dollars in commerce annually. Additional information is available at cryptography.com.

Rambus to Present Innovative Mobile Memory Technology at Linley Tech Mobile Conference 2014

Session will focus on advanced memory solutions in fast-growth mobile device markets

Santa Clara, Calif. – April 30, 2014

Who: Rambus Inc. (NASDAQ: RMBS)
Where: Linley Tech Mobile Conference 2014
Santa Clara, Calif
When: April 30- May 1, 2014

At the Linley Tech Mobile Conference 2014, Rambus Director Ajay Jain will participate in a session demonstrating recent innovative mobile memory solutions for smartphones and tablets, targeting a mid-range market segment that continues to be among the fastest-growing in mobile computing. Jain will highlight a memory solution that uses enhanced signaling techniques to reduce memory subsystem power by up to 25% versus standard LPDDR3 while retaining backward compatibility.

Rambus will also be exhibiting at the Conference, which brings together industry expertise to address system design issues for mobile devices.

Click to Tweet:.@rambusinc will be presenting and sponsoring at the@LinleyGroup Mobile Tech Conference 2014 on 4/30-5/1#Innovation

Presentation:

Session Title: Mobile Memory Solutions for Smartphones and Tablets
12:30 p.m. – 12:30 p.m. AST
Ajay Jain, director of product marketing, Mobile Products, Rambus

Midrange smartphones and tablets are projected to be the fastest-growing segment in mobile computing. Lower device cost may drive this growth, but consumers are unwilling to compromise on performance, capacity, or battery life. This presentation will describe a memory solution that uses enhanced signaling techniques to reduce memory subsystem power up to 25% versus standard LPDDR3 while retaining backward compatibility. By implementing enhanced signaling techniques similar to LPDDR4, SoC developers can achieve increased performance at improved power efficiency with the cost advantages of LPDDR3.

About Rambus Inc.

Rambus brings invention to market. Our customizable IP cores, architecture licenses, tools, services, and training improve the competitive advantage of our customer’s products while accelerating their time-to-market. Rambus products and innovations capture, secure and move data. For more information, visit rambus.com.

Rambus Engineers and Scientists to Present New Research and Training at DesignCon 2014

SANTA CLARA, CALIF. – January 28, 2014

Who: Rambus Inc. (NASDAQ:RMBS)
Where: DesignCon
Santa Clara Convention Center – Booth #301
5001 Great America Parkway, Santa Clara, Calif.
armtechcon.com
When: January 28 – 31, 2014

At DesignCon 2014, Rambus engineers and scientists will present two papers on the latest research in ultra-high speed interface design and deliver training on the latest low-power, high-performance memory solutions.

Additionally, Rambus will be demonstrating various IP cores, tools and emerging architectures designed to deliver robust and easy to integrate solutions in its booth (#301), including: the LabStation™ validation platform, R+™ LPDDR3, and R+ technologies for extending main memory beyond DDR4.

Click to Tweet: @rambusinc will be exhibiting, speaking and demonstrating at@UBMDesignCon 2014 on 1/28-31 #Innovation

Paper Presentations:

Title:“An Implementer’s Guide to Low-Power and High-Performance Memory Solutions”
Rambus Speakers/Authors: Wendem Beyene, John Eble, Ming Li
Date: Tuesday, January 28, 2014
Time: 9:00 a.m.-12:00 p.m.

This session provides an in-depth analysis of standard DRAM memory solutions for low-power and high-performance applications. Specifically, the session will cover the interactions between signaling, clocking and packaging technology of a memory interface, and how this knowledge can be used to analyze and compare different popular memory interfaces for different applications including mobile, compute, graphics, and server.

Title: “Lessons Learned: How to Make Predictable PCB Interconnects for Data Rates of 50 Gbps and Beyond”
Rambus Speakers/Authors: Wendem Beyene
Date: Wednesday, January 29, 2014
Time: 9:20 a.m.-10:00 a.m.

Rambus joins colleagues from the industry to discuss elements for 50 Gbps interconnect design success. The discussion will address practical methodology for dielectric and conductor roughness model identification for accurate analysis of 50 Gbps interconnects, understanding the importance of loss separation in conductor roughness and dielectric models, and the impact of fiber weave effects on signal propagation at higher frequencies.

Title: “Package-PCB Interface Discontinuity Optimization for 50 GB/S SerDes Applications”
Rambus Speakers/Authors: Wendem Beyene, Kevin Cai, Gnanadeep Kollipara, Keisuke Saito, David Secker
Date: Wednesday, January 29, 2014
Time: 11:05 a.m.-11:45 a.m.

This session is focused on system design optimization techniques for the package-PCB interface of a 50Gb/s medium-reach SerDes channel. A summary of optimized design features and relative performance results are presented for conventional and high-density interconnect (HDI) PCB designs.

About Rambus Memory and Interfaces Division (MID)

The Rambus Memory and Interfaces Division moves data. MID develops products and services that solve the power, performance, and capacity challenges of the mobile, cloud computing and connected device markets. Rambus enhanced standards-compatible and custom memory and serial link solutions include architectures, memory and chip-to-chip interfaces, DRAM, IP validation tools, and system and IC design services. Developed through our system-aware design methodology, Rambus’ products deliver improved time-to-market and first-time-right quality.

About Rambus

Rambus brings invention to market. Our customizable IP cores, architecture licenses, tools, services, and training improve the competitive advantage of our customers’ products while accelerating their time-to-market. Rambus products and innovations capture, secure and move data. For more information, visit rambus.com.