• Skip to primary navigation
  • Skip to main content
  • Skip to footer
  • English
  • 简体中文
  • Investor Relations
  • Resource Library
  • Newsroom
  • Blog
  • Careers
  • Support Center
Rambus Logo

Rambus

At Rambus, we create cutting-edge semiconductor and IP products, spanning memory and interfaces to security, smart sensors and lighting.

  • Products
      • All
          • Memory Interface Chips
          • DIMM Chipsets
          • DDR5 DIMM Chipset
          • DDR4 NVRCD
          • DDR4 Register Clock Driver
          • DDR4 Data Buffer
          • CXL Memory Interconnect Initiative
          • Interface IP
          • Memory PHYs
          • GDDR6 PHY
          • HBM3 PHY
          • HBM2E PHY
          • DDR4 PHY
          • More…
          • SerDes PHYs
          • PCIe 6.0 PHY
          • PCIe 5.0 PHY
          • 32G C2C PHY
          • 32G PHY
          • 28G PHY
          • More…
          • Digital Controllers
          • Memory Controllers
          • CXL & PCI Express Controllers
          • MIPI Controllers
          • Video Compression and Forward Error Correction Cores
          • Security IP
          • Root of Trust Solutions
          • Security Protocol Engines
          • Inline Cipher Engines
          • Crypto Accelerator Cores
          • DPA Countermeasures
          • Software Protocols & Crypto Toolkits
          • Anti-Counterfeiting
          • Provisioning and Key Management
      • Memory Interface Chips
        • DIMM Chipsets
          • DDR5 DIMM Chipset
          • Non-Volatile DDR4 Registering Clock Driver
          • DDR4 Register Clock Driver
          • DDR4 Data Buffer
          • DDR3 Register Clock Driver
          • DDR3 Isolation Memory Buffer
        • CXL Memory Interconnect Initiative

        • Made for high speed, reliability and power efficiency, our DDR3, DDR4, and DDR5 DIMM chipsets deliver top-of-the-line performance and capacity for the next wave of computing systems. Learn more about our Memory Interface Chip solutions
      • Interface IP
          • Memory PHYs
            • GDDR6 PHY
            • HBM3 PHY
            • HBM2E PHY
            • DDR4 PHY
            • DDR4 Multi-modal PHY
            • DDR3 PHY
          • SerDes PHYs
            • PCIe 6.0 PHY
            • PCIe 5.0 PHY
            • PCIe 4.0 PHY
            • 32G C2C PHY
            • 32G PHY
            • 28G PHY
            • 16G PHY
            • 12G PHY
            • 6G PHY
          • Digital Controllers
            • HBM3 Controller
            • HBM2E Controller
            • GDDR6 Controller
            • LPDDR5 Controller
            • CXL 2.0 Controller
            • PCIe 6.0 Controller
            • PCIe 5.0 Controller
            • MIPI CSI-2/DSI-2 Controllers
            • Video Compression and Forward Error Correction Cores
            • More…

        • With their reduced power consumption and industry-leading data rates, our line-up of memory interface IP solutions support a broad range of industry standards with improved margin and flexibility. Learn more about our Interface IP solutions
      • Security IP
          • Root of Trust Solutions
          • Security Protocol Engines
            • MACsec Engines
            • IPsec, TLS, SSL Multi-Protocol Engines
            • High Speed Public Key Accelerator
          • Inline Cipher Engines
          • Crypto Accelerator Cores
            • DPA Resistant Cores
            • Basic Crypto Blocks
          • Anti-Counterfeiting
            • CryptoFirewall Cores
            • Circuit Camouflage Technology
          • DPA Countermeasures
            • DPA Resistant Cores
            • DPA Resistant Software Libraries
            • DPA Workstation Platform
          • Software Protocols & Crypto Toolkits
            • IPsec Toolkit
            • FIPs Cryptographic Libraries
            • MACsec Toolkit
            • IoT Security Framework
          • CryptoMedia
            • Content Protection Core
            • Content Protection Services
          • Provisioning and Key Management
            • CryptoManager Provisioning
            • CryptoManager Device Key Management

        • From chip-to-cloud-to-crowd, Rambus secure silicon IP helps protect the world’s most valuable resource: data. Securing electronic systems at their hardware foundation, our embedded security solutions span areas including root of trust, tamper resistance, content protection and trusted provisioning. Learn more about our Security IP offerings
  • Markets
      • AI & Machine Learning
        • Speed and Security for the Artificial Intelligence & Machine Learning Revolution
          • Products
          • SerDes PHYs
          • Memory PHYs
          • Digital Controllers
          • Memory Interface Chips
          • Root of Trust
          • Crypto Accelerator Cores
          • Protocol Engines
          • Provisioning and Key Management
          • AI & Machine Learning
      • Automotive
        • Providing Performance & Security for the Connected Car
          • Products
          • Memory PHYs
          • SerDes PHYs
          • Digital Controllers
          • Root of Trust
          • PKE Engine
          • MACsec Engines
          • Crypto Accelerator Cores
          • Provisioning and Key Management
          • Explore Automotive
      • Data Center
        • Optimizing capacity, connectivity and capability of the cloud
          • Products
          • SerDes PHYs
          • Memory PHYs
          • Digital Controllers
          • Memory Interface Chips
          • Root of Trust
          • MACsec Engines
          • Software Protocols
          • Provisioning and Key Management
          • See Data Center
      • Edge
        • Catching a tidal wave of data
          • Products
          • Memory PHYs
          • SerDes PHYs
          • Digital Controllers
          • Root of Trust
          • Crypto Accelerator Cores
          • Protocol Engines
          • Software Protocols
          • Discover Edge
      • Government
        • Securing Mission-critical Systems
          • Products
          • Root of Trust
          • Protocol Engines
          • Anti-Tamper Cores
          • Provisioning and Key Management
          • DPA Workstation Platform
          • SerDes PHYs
          • Memory PHYs
          • Digital Controllers
          • See Government
      • IoT
        • Making IoT Data Safe & Fast
          • Products
          • Root of Trust
          • TLS Toolkits
          • Provisioning and Key Management
          • Memory PHYs
          • SerDes PHYs
          • Digital Controllers
          • Explore IoT
  • Resources
    • Inventions
    • Buying Guide
    • Resource Library
      • Webinars
      • Product Selector
  • About
      • Corporate Overview
      • Leadership
      • Inventors
      • Careers
      • Locations
      • Investor Relations
      • Newsroom
      • Blog
      • Events
      • Partnerships
      • Certifications
      • Corporate Responsibility
      • Contact
Home > Press Releases > Rambus Advances HBM2E Performance to 4.0 Gbps for AI/ML Training Applications

Rambus Advances HBM2E Performance to 4.0 Gbps for AI/ML Training Applications

Highlights: 

  • Fully-integrated HBM2E memory interface solution, consisting of verified PHY and controller, achieves industry’s fastest performance
  • New benchmark in performance supports accelerators requiring terabyte-scale bandwidth for artificial intelligence/machine learning (AI/ML) training applications
  • Partners with SK hynix and Alchip to develop 2.5D HBM2E memory system solution using TSMC N7 process and CoWoS® advanced packaging technologies
  • Offers unrivaled system expertise supporting customers with interposer and package reference designs to speed time to market

    Read first our primer on:
    HBM2E Implementation & Selection – The Ultimate Guide »

Figure 1 Rambus HBM2E Interface 4 Gbps Transmit Eye
Figure 1 Rambus HBM2E Interface 4 Gbps Transmit Eye

SAN JOSE, Calif. – Sept. 9, 2020 – Rambus Inc. (NASDAQ: RMBS), a premier silicon IP and chip provider making data faster and safer, today announced it has achieved a record 4 Gbps performance with the Rambus HBM2E memory interface solution consisting of a fully-integrated PHY and controller. Paired with the industry’s fastest HBM2E DRAM from SK hynix operating at 3.6 Gbps, the solution can deliver 460 GB/s of bandwidth from a single HBM2E device. This performance meets the terabyte-scale bandwidth needs of accelerators targeting the most demanding AI/ML training and high-performance computing (HPC) applications.

“With this achievement by Rambus, designers of AI and HPC systems can now implement systems using the world’s fastest HBM2E DRAM running at 3.6 Gbps from SK hynix,” said Uksong Kang, vice president of product planning at SK hynix. “In July, we announced full-scale mass-production of HBM2E for state-of-the-art computing applications demanding the highest bandwidth available.”

The fully-integrated, production-ready Rambus HBM2E memory subsystem runs at 4 Gbps without PHY voltage overdrive. Rambus teamed with SK hynix and Alchip to implement the HBM2E 2.5D system to validate in silicon the Rambus HBM2E PHY and Memory Controller IP using TSMC’s N7 process and CoWoS® (Chip-on-Wafer-on-Substrate) advanced packaging technologies. Co-designing with the engineering team from Rambus, Alchip led the interposer and package substrate design.

“This advancement of Rambus and its partners, using TSMC’s advanced process and packaging technologies, is another important achievement of our ongoing collaboration with Rambus,” said Suk Lee, senior director of the Design Infrastructure Management Division at TSMC. “We look forward to a continued partnership with Rambus to enable the highest performance in AI/ML and HPC applications.”

“Alchip brought a demonstrated track record of success in 7nm and 2.5D package design to this initiative,” said Johnny Shen, CEO of Alchip Technologies. “We’re extremely proud of our contributions to Rambus’ breakthrough achievement.”

Rambus has 30 years of high-speed memory design applied to the most demanding computing applications. Its renowned signal integrity expertise was key to achieving an HBM2E memory interface capable of 4 Gbps operation. This raises a new benchmark for meeting the insatiable bandwidth requirements of AI/ML training.

“With silicon operation up to 4 Gbps, designers can future-proof their HBM2E implementations and can be confident of ample margin for 3.6 Gbps designs,” said Matthew Jones, senior director and general manager of IP cores at Rambus. “As part of every customer engagement, Rambus provides reference designs for the 2.5D package and interposer to ensure first-time right implementations for mission-critical AI/ML designs.”

Benefits of the Rambus HBM2E Memory Interface (PHY and Controller):

  • Achieves the industry’s highest speed of 4 Gbps per pin, delivering a system bandwidth of 460 GB from a single 3.6 Gbps HBM2E DRAM 3D device.
  • Fully-integrated and verified HBM2E PHY and Controller reduces ASIC design complexity and speeds time to market
  • Includes 2.5D package and interposer reference design as part of IP license
  • Provides access to Rambus system and SI/PI experts helping ASIC designers to ensure maximum signal and power integrity for devices and systems
  • Features LabStation™ development environment that enables quick system bring-up, characterization and debug
  • Supports high-performance applications including state-of-the-art AI/ML training and high-performance computing (HPC) systems

For more information on the Rambus Interface IP, including our PHYs and Controllers, please visit rambus.com/interface-ip.

Footer

About

  • Corporate Overview
  • Leadership
  • Careers
  • Locations
  • Investor Relations
  • News
  • Corporate Responsibility

Products

  • Memory PHYs
  • SerDes PHYs
  • Digital Controllers
  • Server DIMM Chipsets
  • Root of Trust Solutions
  • Provisioning and Key Management
  • Protocol Engines
  • Crypto Accelerator Cores
  • Software Protocols
  • DPA Countermeasures
  • Anti-Counterfeiting
  • CryptoMedia

Markets

  • AI & Machine Learning
  • Automotive
  • Data Center
  • Edge
  • Government
  • IoT
  • Pay TV

Resources

  • Resource Library
  • Webinars
  • Inventions
  • Buying Guide
  • Contact

Copyright © 2023 Rambus.com. All Rights Reserved. Privacy Policy | Trademark & Guidelines

  • Facebook icon
  • Twitter icon
  • YouTuve icon
  • LinkedIn icon
  • Blog icon