At Rambus, we create cutting-edge semiconductor and IP products, providing industry-leading chips and silicon IP to make data faster and safer.
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Security Response Center
https://www.rambus.com/security/response-center/Rambus Security Response Center Contact Us Rambus prides itself on building products and services that our customers value to help protect the world’s most valuable resource: data. Securing electronic systems at their hardware foundation, our embedded security solutions span areas including root of trust, tamper resistance, content protection and trusted provisioning. This Rambus Security Response […]
Extending Security IP leadership with FIPS 140-2 CMVP Certification for Root of Trust IP
https://www.rambus.com/blogs/extending-security-ip-leadership-with-fips-140-2-cmvp-certification-for-root-of-trust-ip/We’ve expanded our portfolio of certified security IP with the Rambus RT-630 Root of Trust having received FIPS 140-2 CMVP certification. By meeting the Federal Information Processing Standards (FIPS) Cryptographic Module Validation Program (CMVP) requirements, the RT-630 enables customers to quickly and confidently deploy the IP for applications where FIPS compliance and the highest levels […]
Even More CXL Webinar Q&A!
https://www.rambus.com/blogs/even-more-cxl-webinar-q-and-a/We had such a great response to last week’s More CXL Webinar Q&A blog that we decided to reprise the questions answered live in our webinar How CXL Technology will Revolutionize the Data Center (available on-demand). Hope this provides more insights on the capabilities of Compute Express Link™ (CXL™) technology. Click on a link below […]
More CXL Webinar Q&A
https://www.rambus.com/blogs/more-cxl-webinar-q-and-a/In our recent webinar How CXL Technology will Revolutionize the Data Center (available on-demand), we received far more questions than we had time to address during the scheduled Q&A. What follows are answers to many of those questions providing greater context on the capabilities of Compute Express Link™ (CXL™) technology. Click on a link below […]
Automotive Security: Meeting the Growing Challenges
https://go.rambus.com/automotive-security-meeting-the-growing-challenges#new_tabVehicle systems and the semiconductors used within them represent some of today’s most complex electronics. In the drive to autonomous vehicles, increasingly sophisticated electronic systems are being developed for powertrain and vehicle dynamics, advanced driver assistance systems (ADAS), vehicle-to-everything (V2E) connectivity, infotainment, and in-vehicle experience. In addition to achieving higher levels of performance, these systems […]
VESA Display Stream Compression (DSC): The Complete Guide
https://www.rambus.com/blogs/vesa-display-stream-compression-dsc-the-complete-guide/Learn everything you need to know about VESA Display Stream Compression (DSC), simply explained in our blog. Start reading! Display technology has advanced in leaps and bounds over the past decade. Electronics manufacturers have been using increasingly sophisticated display features as a way of differentiating their products in the highly competitive consumer electronics market. Each […]
Going Beyond the Requirements of a Root of Trust for Measurement with the Silicon-Proven RT-660 Root of Trust
https://go.rambus.com/going-beyond-the-requirements-of-a-root-of-trust-for-measurement#new_tabThe continuously evolving technology landscape and security requirements for systems present many challenges for device and silicon manufacturers. Nowhere is this truer than in data centers. Rambus has long recognized the need for security designs in data centers, and the Caliptra initiative discussed in this whitepaper is a welcome step towards a widespread adoption of […]
Accelerating AI/ML applications in the data center with HBM3
https://www.rambus.com/blogs/accelerating-ai-ml-applications-in-the-data-center-with-hbm3/Semiconductor Engineering Editor in Chief Ed Sperling recently spoke with Frank Ferro, Senior Director of Product Management at Rambus, about accelerating AI/ML applications in the data center with HBM3. Introduced by JEDEC in early 2022, the latest iteration of the high bandwidth memory standard increases the per-pin data rate to 6.4 Gigabits per second (Gb/s), […]
Rambus Reports Third Quarter 2022 Financial Results
https://www.rambus.com/third-quarter-2022-financial-results/Exceeded guidance for Q3 revenue and earnings Delivered record quarterly product revenue driven by memory interface chips Generated $80 million in cash from operations Initiated $100 million accelerated share repurchase program SAN JOSE, Calif. – October 31, 2022– Rambus Inc. (NASDAQ:RMBS), a provider of industry-leading chips and IP making data faster and safer, today reported […]
Rambus and Samsung Electronics Extend Comprehensive Agreement
https://www.rambus.com/rambus-and-samsung-electronics-extend-comprehensive-agreement/Ten-year agreement enables deep collaboration on products and broad access to Rambus innovations SAN JOSE, Calif. – Oct. 31, 2022 – Rambus Inc. (NASDAQ: RMBS), a premier chip and silicon IP provider making data faster and safer, today announced it has extended its comprehensive patent license agreement with Samsung Electronics, a world leader in advanced semiconductor […]
