At Rambus, we create cutting-edge semiconductor and IP products, spanning memory and interfaces to security, smart sensors and lighting.
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Memory Systems for AI: Part 3
https://www.rambus.com/blogs/memory-systems-for-ai-part-3/Written by Steven Woo for Rambus Press In part two of this series, we took a closer look at how the upcoming deployment of 5G technology will enable processing at the edge, and how the industry is further refining the edge into the near edge and the far edge. The near edge is closer to […]
Complete Memory Interface Solution for HBM2E Launched
https://www.rambus.com/blogs/complete-memory-interface-solution-for-hbm2e-launched/Rambus has announced a comprehensive interface solution for HBM2E memory consisting of co-verified PHY and memory controller. Operating at a top speed of 3.2 Gbps over a 1024-bit wide interface, the interface can deliver 410 GB/s of bandwidth with a single HBM2E DRAM stack. Read first our primer on: HBM2E Implementation & Selection – The […]
2.5D/3D Packaging Solutions for AI and HPC
https://go.rambus.com/packaging-solutions-for-ai-and-hpc#new_tabFor AI and HPC applications, HBM2E memory can deliver excellent bandwidth, capacity and latency in a very compact footprint thanks to its 2.5D/3D structure. The flipside is that this same structure leads to greater design complexity and raises a new set of implementation considerations.
Memory For Advanced Designs
https://www.forbes.com/sites/tomcoughlin/2020/02/26/memory-for-advanced-designs/#7131ec20188f#new_tabThe 2020 Designcon conference included many talks and exhibits with a storage and memory focus. Both Rambus and Teledyne LeCroy had tutorials on design and connectivity for leading edge electronic components and systems as well as testing memory systems. This piece will look at some material from the tutorials and exhibits that can inform us about disaggregated […]
Memory Systems for AI: Part 2
https://www.rambus.com/blogs/memory-systems-for-ai-part-2/In part one of this series, we discussed how the world’s digital data is growing exponentially, doubling approximately every two years. In fact, there’s so much digital data in the world that artificial intelligence (AI) is practically the only way to begin to make sense of it all in a timely fashion. Insights gleaned from […]
Memory Systems for AI: Part 1
https://www.rambus.com/blogs/memory-systems-for-ai-part-1/Written by Steven Woo for Rambus Press There has been quite a lot of recent news about domain-specific processors that are being designed for the artificial intelligence (AI) market. Interestingly, many of the techniques used today in modern AI chips and applications have actually been around for several decades. However, neural networks didn’t really take […]
What does security look like when 5G meets AI?
https://www.rambus.com/5gsecurity/What does security looklike when 5G meets AI? Incredible synergies will be realized when 5G meets AI. Security anchored in hardware can protect the great value created. Learn how Rambus solutions secure the chips powering the 5G-AI revolution. 5G and AI Raise Security Risks for IoT Devices April 30th @ 11am PT | 2pm ET […]
Hardware Attack Surface Widening
https://semiengineering.com/hardware-attack-surface-widening/#new_tabAn expanding attack surface in hardware, coupled with increasing complexity inside and outside of chips, is making it far more difficult to secure systems against a variety of new and existing types of attacks. Security experts have been warning about the growing threat for some time, but it is being made worse by the need […]
Cliff Burnette
https://www.rambus.com/leadership/cliff-burnette/Cliff Burnette Senior Vice President & Chief Human Resources Officer Cliff Burnette is the senior vice president and chief human resources officer (CHRO) of Rambus. Cliff joined the company in 2019 and brings over 20 years of experience leading global human resources (HR) operations for publicly traded companies. He is responsible for human resources, corporate […]
Rambus Reports Fourth Quarter and Fiscal Year 2019 Financial Results
https://www.rambus.com/fourth-quarter-fiscal-year-2019-financial-results/Excellent quarter, exceeding expectations; GAAP revenue of $59.9 million; with licensing billings of $63.8 million, product revenue of $26.6 million, and contract and other revenue of $13.9 million Record Q4 and full-year revenue for both the Memory Interface Chips and Silicon IP businesses $35.4 million in cash provided by operating activities in Q4 and $128.5 […]
