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Below is an archive of Rambus videos.
Rambus is committed to helping students learn and thrive so they can become the future innovators and entrepreneurs that Silicon Valley is famous for.
Find out how you can help by visiting familygivingtree.org today.
Rambus Lensless Smart Sensors (LSS) take a novel approach to sensing by combining ultra-small diffractive gratings with standard image sensors to deliver advanced capabilities in a form factor ideal for AR and VR devices. Light passes through the diffractive grating and is spread in the image sensor below to show an information rich blob that contains all the pertinent data about a user’s gaze.
With it’s small size, LSS can be hidden in the frames of everyday eyewear, making eye tracking hardware invisible to the outside world and enabling users to experience AR without compromising style, design or comfort.
To learn more about Rambus Lensless Smart Sensors, click here.
Lensless Smart Sensor (LSS) technology is helping to enable a new generation of low-power sensing by capturing information-rich images with a low-cost phase grating, standard image sensors and sophisticated computational algorithms. To accelerate LSS adoption and further explore additional use cases, Rambus has released its POD 2.0 evaluation system for LSS technology. The POD 2.0 is designed to allow OEMs and system designers an easy way to assess LSS fitness for their applications.
To learn more about Rambus Lensless Smart Sensors, click here.
Lensless Smart Sensor technology takes a novel approach to sensing by combining ultra-small diffractive gratings with standard image sensors. Light passing through the diffractive grating is intelligently spread onto the image sensor below to form an unrecognizable, but information-rich blob that contains all of the pertinent data from the scene. This information is combined with application-specific algorithms that can either visually reconstruct a scene, or extract relevant data, like the number and position of occupants directly from the blob. LSS uses the processed metadata to detect and interpret activity within a space at a size and performance previously unattainable with existing building sensing technologies, all without compromising privacy.
Through the use of diffractive optics, LSS captures information about a building’s occupants while fully preserving their privacy. The presence of someone, the number of people, and general activity can be passively detected, and used to trigger other systems and functions in the building.
LSS can also be deployed with thermal capabilities, so rooms can adjust automatically to the comfort level of occupants. Heating, cooling and lighting can be directed appropriately, and energy can be used only where needed. By rethinking the way digital systems see, LSS creates and intelligent infrastructure that can adapt to the ever-changing needs of a building’s occupants.
To learn more about Rambus Lensless Smart Sensors, click here.
DPA Workstation 8 (DPAWS), is the premiere side-channel analysis platform, that includes an integrated suite of hardware and powerful data visualization software for testing and analyzing the vulnerabilities of cryptographic chips to power electromagnetic side-channel attacks. With this platform, users can test every stage of the side-channel analysis process, including exploration, acquisition, signal- and pre-processing, prediction, partitioning and analysis, and hypothesis evaluation. As part of the upgrades to DPAWs, we’ve added a project library manager to aid the rapid analysis of collected data by delivering an integrated view of multiple data sets, scripts and analyses, an all new powerful trace display with an intuitive interface for easy analysis, and integrated scripting modules for MatLab and Python to allow for easier analysis and increased productivity.
To learn more about DPAWS, click here.
SK hynix, Inc., Amkor Technology, eSilicon, Northwest Logic and Avery Design Systems have joined forces to offer a complete High Bandwidth Memory (HBM) supply chain solution. HBM is a JEDEC-defined standard that utilizes 2.5D technology to interconnect a SoC and a HBM memory stack.
To learn more about the Rambus HBM2E Controller, click here.