Benjamin Jun’s presentation at the 2008 RSA Conference.
XDR DRAM Passes 50 Million Units Shipped Milestone
Award-winning memory architecture delivers superior bandwidth performance for advanced computing and consumer electronics applications
LOS ALTOS, CALIFORNIA, UNITED STATES – 03/31/2008 – Rambus Inc. (NASDAQ:RMBS), one of the world’s premier technology licensing companies specializing in high-speed chip architectures, today announced that its customers have shipped over 50 million XDR™DRAM devices worldwide.
The award-winning XDR memory architecture features key enabling technologies built on patented Rambus innovations that include low-voltage, low-power Differential Rambus Signaling Level (DRSL); Octal Data Rate (ODR) technology that transfers eight bits of data each clock cycle; FlexPhase™ circuit technology for precise on-chip alignment of data with clock; and Dynamic-Point-to-Point (DPP) for both enhanced signal integrity and scalability.
“The demand for high-performance, cost-effective memory solutions continues to grow dramatically,” said Yoshitaka Kinoshita, officer for the Digital Consumer Division of Elpida Memory, Inc. “Thanks to the XDR memory architecture, Elpida can provide our customers superior DRAM products enabling amazing new capabilities.”
Proven in high-volume, cost-competitive applications, the XDR memory architecture operating at 4.8Gbps provides an unmatched 9.6GB/s of peak memory bandwidth with a single, 2-byte wide XDR DRAM. With a roadmap extending to 8.0Gbps providing 16.0 GB/s of bandwidth per device, XDR DRAM provides an order of magnitude higher performance than today’s standard memories. With XDR DRAM, designers can achieve unprecedented performance with the fewest devices.
“The XDR memory architecture is an ideal solution for advanced consumer and computing applications,” said Sharon Holt, senior vice president of worldwide sales, licensing and marketing at Rambus. “Our complete XDR memory solution and comprehensive engineering services minimize risk and help our customers bring breakthrough products to market.”
Recent milestones from XDR DRAM licensees include the October 2007 introduction of the industry’s fastest DRAM, the 512 Megabit (Mb), 4.8Gbps XDR DRAM by Elpida Memory Inc., providing an industry-leading data transfer rate of 9.6 Gigabytes per second (GB/s) with a single device. In addition, Qimonda AG has started shipping samples of its 512Mb XDR DRAM.
For more information on the XDR memory architecture please visit www.rambus.com/xdr.
About Rambus Inc.
Rambus is one of the world’s premier technology licensing companies specializing in the invention and design of high-speed chip architectures. Since its founding in 1990, the Company’s patented innovations, breakthrough technologies and renowned integration expertise have helped industry-leading chip and system companies bring superior products to market. Rambus’ technology and products solve customers’ most complex chip and system-level interface challenges enabling unprecedented performance in computing, communications and consumer electronics applications. Rambus licenses both its world-class patent portfolio as well as its family of leadership and industry-standard interface products. Headquartered in Los Altos, California, Rambus has regional offices in North Carolina, India, Germany, Japan, Korea and Taiwan. Additional information is available at www.rambus.com.
*Winner of the International Engineering Consortium (IEC) 2008 DesignVision Award in the Semiconductors and ICs (IP) category. The IEC DesignVision Awards recognize technologies, applications, products, and services judged to be the most unique and beneficial to the industry.
Rambus and the Rambus logo are registered trademarks of Rambus Inc. XDR is a trademark of Rambus Inc. All other trade names are the service marks, trademarks, or registered trademarks of their respective owners.
Rambus to Host Conference Call to Discuss Jury Verdict in Coordinated Trial
LOS ALTOS, CALIFORNIA, UNITED STATES – 03/27/2008 – Rambus Inc. (Nasdaq:RMBS), one of the world’s premier technology licensing companies specializing in high-speed memory architectures, will hold a conference call on Thursday, March 27, 2008 at 2:00 p.m. Pacific Time to discuss the jury verdict in the coordinated trial with the memory manufacturers.
This call will be webcast and can be accessed via Rambus’ web site at https://investor.rambus.com. A replay will be available following the call on Rambus’ Investor Relations web site or for one week at the following numbers: (888) 203-1112 (domestic) or (719) 457-0820 (international) with ID# 4120285.
About Rambus Inc.
Rambus is one of the world’s premier technology licensing companies specializing in the invention and design of high-speed memory architectures. Since its founding in 1990, the Company’s patented innovations, breakthrough technologies and renowned integration expertise have helped industry-leading chip and system companies bring superior products to market. Rambus’ technology and products solve customers’ most complex chip and system-level interface challenges enabling unprecedented performance in computing, communications and consumer electronics applications. Rambus licenses both its world-class patent portfolio as well as its family of leadership and industry-standard interface products. Headquartered in Los Altos, California, Rambus has regional offices in North Carolina, India, Germany, Japan, Korea and Taiwan. Additional information is available at www.rambus.com.
New Banking Customer in Canada
Bell ID, worldwide technology leader in the field of smart card management solutions, today announced that it will be providing a full EMV solution for managing over two million cards, to a major Canadian financial institution.
Bell ID will implement and support its ANDiS4EMV smart card management solution, enabling the bank to migrate its card base from magnetic stripe to MULTOS step one EMV chip cards.
The ANDiS4EMV solution from Bell ID comprises of a powerful card, application and key management system and data preparation engine. In addition, the solution leverages the ANDiS LDAP capabilities, and profits from Bell ID’s comprehensive web services interfaces, facilitating the integration with core retail banking systems including the customer service and IVR operations.
In line with the bank’s business plans, a number of additional ANDiS features will be enabled as part of a phased implementation approach. These include the multi-application server, post issuance personalization module and EMV Scripting solution.
Hugo Crawford, Sales Manager – Americas at Bell ID commented, “We are very pleased with this win and it further strengthens Bell ID’s position as the leading provider of EMV card management solutions in the Canadian market. It also testifies to the fact that financial institutions recognize the benefits that the ANDiS solution offers – not only does ANDiS4EMV provide the means for a smooth transition to EMV chip cards, but it enables the card issuer to exploit the full potential of the cards and maximize their return on investment”.
Rambus Wins Coordinated Trial Against Memory Manufacturers
Jury found Rambus acted properly while member of standard-setting organization
LOS ALTOS, CALIFORNIA, UNITED STATES – 03/26/2008 – Rambus Inc. (Nasdaq:RMBS) today announced that the jury in the case involving Hynix Semiconductor (000660.KS), Micron Technologies (NYSE:MU), and Nanya Technology Corporation (2408.TW) has found in favor of Rambus. The jury determined that Rambus acted properly while a member of the standard-setting organization JEDEC during its participating in the early 1990s, finding that the memory manufacturers did not meet their burden of proving antitrust and fraud claims. This verdict should complete the case involving Hynix. Hynix was found by a previous jury in April 2006 to infringe a variety of Rambus patents. In that phase of trial, Rambus was awarded $133.6M in damages.
“This ruling should put to rest a series of ongoing allegations Rambus has endured for many years,” said Tom Lavelle, senior vice president and general counsel at Rambus. “Our business is to license our revolutionary technology to the industry for fair compensation. We are pleased to have this decision behind us as we continue to engage with the industry to deliver compelling products to the market.”
The case with Hynix was originally filed by Hynix against Rambus in August 2000. The Honorable Ronald Whyte split the case into three separate phases with Rambus now prevailing in all three phases. Cases are still pending against Hynix, Nanya, Micron and Samsung in the Northern District of California, and with Micron in the District of Delaware.
About Rambus Inc.
Rambus is one of the world’s premier technology licensing companies specializing in the invention and design of high-speed memory architectures. Since its founding in 1990, the Company’s patented innovations, breakthrough technologies and renowned integration expertise have helped industry-leading chip and system companies bring superior products to market. Rambus’ technology and products solve customers’ most complex chip and system-level interface challenges enabling unprecedented performance in computing, communications and consumer electronics applications. Rambus licenses both its world-class patent portfolio as well as its family of leadership and industry-standard interface products. Headquartered in Los Altos, California, Rambus has regional offices in North Carolina, India, Germany, Japan, Korea and Taiwan. Additional information is available at www.rambus.com.
Media Alert – Rambus to Demonstrate High-speed Memory Technologies and Architectures at DATE 2008
LOS ALTOS, CALIFORNIA, UNITED STATES – 03/10/2008
| Who: | Rambus Inc. (Nasdaq: RMBS) | |
| Where: | DATE 2008 Booth # A18 ICM Munich, Germany |
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| When: | March 11-13, 2008 | |
Join Rambus at DATE 2008, the European event for electronic system design and test, for demos and displays of our latest technology developments.
Rambus Demos and Displays
- The Terabyte Bandwidth Initiative, featuring new memory signaling innovations that facilitate data rates of 16Gbps and a future memory architecture that can deliver an unprecedented terabyte per second (TB/s) of memory bandwidth (1 terabyte = 1,024 gigabytes) to a single System-on-Chip (SoC). Innovations include the industry’s first differential signaling for both data and command/address (C/A); FlexLink™ C/A, the industry’s first full-speed, point-to-point C/A link; and 32X Data Rate technology (32 data bits per input clock cycle).
- A multi-Gbps low-power signaling demonstration with a test transceiver dissipating only 14 mW, resulting in a power/performance metric of 2.2 mW/Gbps, a power reduction by a factor greater than three times (3x) that of traditional serial links.
- The award-winning XDR™ memory architecture, a differential memory system solution, operating at 5.6Gbps with FlexPhase™ circuit technology calibration and Octal Data Rate (ODR) read/write operation.
- A low-cost XDR system solution implemented on a 2-layer printed circuit board.
- A DDR3 memory controller interface signaling demonstration at 1066Mbps.
- A Texas Instruments® DLP® open demo board featuring XDR technology. In this application, the Rambus XDR memory interface operates at 4.0Gbps and brings unparalleled memory performance to the TI DLP processor.
- A PLAYSTATION®3 (PS3™) open demo board featuring XDR technology. The Rambus XDR memory interface and FlexIO™ processor bus enable an unprecedented aggregate bandwidth of over 90 gigabyte-per-second between the Cell Broadband Engine™ and supporting chips at the heart of the PS3.
For registration and additional information, please visit https://www.date-conference.com.
About Rambus Inc.
Rambus is one of the world’s premier technology licensing companies specializing in the invention and design of high-speed memory architectures. Since its founding in 1990, the Company’s patented innovations, breakthrough technologies and renowned integration expertise have helped industry-leading chip and system companies bring superior products to market. Rambus’ technology and products solve customers’ most complex chip and system-level interface challenges enabling unprecedented performance in computing, communications and consumer electronics applications. Rambus licenses both its world-class patent portfolio as well as its family of leadership and industry-standard interface products. Headquartered in Los Altos, California, Rambus has regional offices in North Carolina, India, Germany, Japan, Korea and Taiwan. Additional information is available at www.rambus.com.
Rambus and the Rambus logo are registered trademarks of Rambus Inc. XDR, FlexPhase and FlexLink are trademarks of Rambus Inc. All other trade names are the service marks, trademarks, or registered trademarks of their respective owners.
