Rambus has announced the availability of its High Bandwidth Memory (HBM) Gen2 PHY developed for the GLOBALFOUNDRIES FX-14TM ASIC Platform. Designed for systems that require low latency and high bandwidth memory, the Rambus HBM PHY, built on the GLOBALFOUNDRIES advanced 14nm Power Plus (LPP) process technology, is targeted at networking and data center applications.
According to Luc Seraphin, general manager of the Memory and Interfaces Division at Rambus, the new PHY is fully compliant with the JEDEC HBM2 standard and supports data rates up to 2000 Mbps per data pin, enabling a total bandwidth of 256 Giga bytes per second. The HBM PHY, says Seraphin, is another key component in Rambus’ memory and SerDes high-speed interface IP portfolio for networking and data center applications.
“The needs of data centers are continuously changing and we are at the forefront of delivering memory interface technology designed to meet today’s most demanding workloads,” explained Seraphin. “Through our partnership with GLOBALFOUNDRIES, we are delivering a comprehensive and robust solution for high-performance data center and networking applications. Our HBM offering will allow data center solution developers to bring high performance memory closer to the CPU, thus reducing latency and improving system throughput.”
As Seraphin notes, the Rambus HBM PHY delivers high performance with reduced power consumption when compared to other memory solutions. It combines 2.5D packaging with a wider interface (1024 bits) at a lower clock speed, which results in a higher overall throughput while remaining energy efficient for even the most high-performance computing applications.
“Rambus experts also perform complete signal and power integrity analysis on the entire 2.5D systems to ensure all signal and thermal requirements are met,” Seraphin added.
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