AI/ML changes everything, impacting every industry and touching the lives of everyone. With AI training sets growing at a pace of 10X per year, memory bandwidth is a critical area of focus as we move into the next era of computing and enable this continued growth. AI training and inference have unique feature requirements that can be served by tailored memory solutions. Learn how HBM3 and GDDR6 provide the high performance demanded by the next wave of AI applications.
HBM3 and GDDR6: Memory Solutions for AI
Rambus Joins the Intel Foundry Services (IFS) Accelerator IP Alliance to Enable State-of-the-Art SoCs
Highlights:
- Brings access to industry-leading silicon IP from Rambus to IFS customers
- Simplifies SoC design and accelerates time to market
- Meets the needs of advanced applications in data center, edge, 5G, automotive and military-aerospace
SAN JOSE, Calif. – April 12, 2023 – Rambus Inc. (NASDAQ: RMBS), a premier chip and silicon IP provider making data faster and safer, today announced it has joined the Intel Foundry Services (IFS) Accelerator IP Alliance. Through the alliance, Rambus will have access to Intel’s process roadmaps to provide advanced security and interface IP solutions optimized for performance, power, area and security for Intel process and packaging technologies. With Rambus IP on IFS, customers can design state-of-the-art SoCs for the data center, edge, 5G, automotive and military-aerospace applications.
“As part of our IDM 2.0 strategy, IFS is partnering with leading IP companies like Rambus to create a robust chip design ecosystem that will help our mutual customers deliver leading-edge silicon performance for the most demanding applications,” said Suk Lee, VP of Ecosystem Development Office at IFS. “As the first open system foundry, our advanced process & packaging technologies and resilient supply chain, combined with Rambus IP, will lead the way to solutions that power our digital world.”
Rambus offers some of the world’s highest performance memory and interconnect interface IP, and the industry’s broadest portfolio of security IP solutions. Rambus security IP and provisioning solutions secure billions of devices annually.
“Rambus is a renowned provider of industry-leading IP solutions to customers across a broad market landscape including fast-growing data center and AI/ML applications,” said Sean Fan, chief operating officer at Rambus. “We are proud to join the Intel Foundry Services Accelerator IP Alliance and look forward to delivering IP to our mutual customers, enabling the most advanced SoCs.”
More Information:
For more information on Rambus joining the Intel Foundry Services Ecosystem Alliance, please visit rambus.com/partners/rambus-partner-program/.
Rambus and SK hynix Extend Comprehensive License Agreement
Agreement extended by ten years to 2034, enabling long-term collaboration on products and broad access to Rambus innovations
SAN JOSE, Calif. – April 4, 2023 – Rambus Inc. (NASDAQ: RMBS), a premier chip and silicon IP provider making data faster and safer, today announced it has extended its comprehensive patent license agreement with SK hynix, a world leader in advanced semiconductor technology, for an additional ten years. Effective July 1, 2024, the extension maintains similar financial terms and provides SK hynix with broad access to the full Rambus patent portfolio through mid 2034. Other terms and details are confidential.
“SK hynix is a longstanding partner and customer, and we are very pleased to extend our strong relationship well ahead of the agreement’s expiration date,” said Luc Seraphin, president and chief executive officer of Rambus. “Both Rambus and SK hynix are committed to advancing the industry with world-class products and technology, and this extension is a testament to the ongoing value of our intellectual property and our continued product collaborations together.”
Heterogenous Integration – Chiplets
Chiplets are a growing trend within the semiconductor industry. And to many, represent a paradigm change for chip designers and chip consumers alike. Rather than a traditional single piece of monolithic silicon with many functions and features, a chiplet contains one or a very limited set of functions and features. Multiple chiplets are then assembled into a MCM (multi-chiplet module). Chiplets can offer multiple advantages over monolithic silicon. Learn the advantage and challenges, along with recommendations for the industry’s successful deployment of heterogenous chiplets.
Accelerating Data Interconnects with PCI Express 6.0 Interface IP
The latest generation of PCI Express® (PCIe®) 6.0, advances performance to 64 GT/s in support of advanced data center workloads and networking. In this presentation, interface technology expert Lou Ternullo will discuss the new features implemented in PCIe 6.0, such as PAM4 signaling and low-latency forward error correction (FEC). He will also show how the Rambus PCIe interface IP can support your future design requirements.
CC-312 CryptoCell Root of Trust Product Brief
Ideal for power and space-sensitive applications like IoT sensor and edge devices, the CC-312 Root of Trust offers the best balance of size and performance available on the market.
