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Rambus has validated interoperability between its HBM2 PHY and Northwest Logics’ HBM2 Memory Controller Core. The combined HBM2 solution is designed to support high-performance networking and server applications in the data center and communications markets that require the maximum amount of bandwidth available provided by HBM2. According to Luc Seraphin, senior vice president and general […]
Integrated HBM2 PHY and Memory Controller provide validated, standards-compliant memory subsystem with superior signal integrity and reliability SUNNYVALE, Calif. – Aug. 23, 2017 – Rambus Inc. (NASDAQ: RMBS), an innovator in semiconductor and IP products, today announced validated interoperability between its HBM2 PHY and Northwest Logics’ HBM2 Memory Controller Core. The solution builds on the growing ecosystem […]
2Tbps multi-lane HBM2 PHY Earlier this month, GLOBALFOUNDRIES demonstrated silicon functionality of a 2.5D packaging solution for its high-performance 14nm FinFET FX-14 integrated design system for application-specific integrated circuits (ASICs). The 2.5D ASIC solution includes a stitched interposer capability to overcome lithography limitations and a two terabits per second (2Tbps) multi-lane HBM2 PHY, developed in […]
Juniper Research analysts forecast that wireless VR headsets (smartphone-based and standalone) data consumption will increase by over 650% over the next 4 years, from nearly 2,800PB (Petabytes) in 2017 to over 21,000PB in 2021. Moreover, when combined with traffic generated by VR headsets tethered to PCs and consoles, data consumption is expected to reach over […]
There are many who would dispute the notion that we are living in a post-GIGO (Garbage In, Garbage Out) world. Nevertheless, it is undeniable that the ubiquitous Internet of Things (IoT) has created a digital tsunami of valuable data generated by a wide range of devices, systems and IoT endpoints such as vehicles, wearables, smartphones […]
GLOBALFOUNDRIES has demonstrated silicon functionality of a 2.5D packaging solution for its high-performance 14nm FinFET FX-14™ integrated design system for application-specific integrated circuits (ASICs). According to Kevin O’Buckley, VP of ASIC product development at GF, the 2.5D ASIC solution includes a stitched interposer capability to overcome lithography limitations and a two terabits per second (2Tbps) […]
Northwest Logic’s MIPI CSI-2 Controllers are Widely Used in Automotive Designs Automobiles are increasingly using low cost, high performance MIPI Camera Serial Interface (CSI-2) based cameras for an enhanced driver experience (backup cameras, collision detection, autonomous driving, etc.). Northwest Logic’s receive and transmit CSI-2 Controller Cores are being used to transport video between in-car cameras […]
Silicon-proven sub-system enables easy integration with pre-validated PHY, controller and verification IP SUNNYVALE, Calif. – May 17, 2017 – Rambus Inc. (NASDAQ:RMBS), today announced it is collaborating with PLDA, the industry leader in PCI Express® controller IP solutions, and Avery Design Systems Inc., an innovator in functional verification productivity solutions, to offer a comprehensive, silicon-proven […]
Gary Hilson of the EE Times has written a detailed article about Rambus’ 56G SerDes PHY. As Hilson notes, the analog-to-digital converter (ADC) and (DSP) architecture of Rambus’ 56G SerDes PHY is designed meet the long-reach backplane requirements for the industry transition to 400 GB Ethernet applications. This means it can support scaling to speeds […]
Rambus’ Bill Fuller recently penned an article for Semiconductor Engineering about HBM2 DRAM. As Fuller observes, HBM DRAM is currently used in graphics, high-performance computing (HPC), server, networking and client applications. Recent examples of second-generation HBM deployment include NVIDIA’s Quadro GP100 GPU which is paired with 16GB of stacked (through-silicon via) ECC HBM2 (High Bandwidth […]