At Rambus, we create cutting-edge semiconductor and IP products, spanning memory and interfaces to security, smart sensors and lighting.
Found 142 Results
Micron, Rambus, Northwest Logic and Avery Design to Deliver a Comprehensive GDDR6 Solution for Next-Generation Applications
https://www.rambus.com/micron-rambus-northwest-logic-avery-design-deliver-gddr6-solution/BOISE, Idaho, Jan. 23, 2018 (GLOBE NEWSWIRE) — Micron Technology, Inc. (NASDAQ:MU), a leading memory and storage provider, today announced with Rambus Inc., Northwest Logic and Avery Design, their efforts to deliver a comprehensive solution for GDDR6, the world’s fastest discrete memory. This first-of-its-kind solution would enable GDDR6 use in advanced applications such as high-performance […]
Controllers Newsletter – Q4 2017
https://www.rambus.com/controllers-newsletter-q4-2017/Northwest Logic’s PCI Express 4.0® Solution Passed Testing at the December PCI Express 4.0 FYI Compliance Workshop Northwest Logic’s PCI Express 4.0 solution, including the Expresso 4.0 Core and DMA Core, in combination with the Xilinx Ultrascale+ PCIe® PHY, passed all Gold and Interoperability tests at the December 2017 PCI-SIG FYI Compliance Workshop. Hardware testing […]
Let’s talk about 7nm
https://www.rambus.com/blogs/lets-talk-7nm/Frank Ferro, a senior director of product management at Rambus, recently penned an article for Semiconductor Engineering about the promises and challenges of 7 nanometers (nm). According to Ferro, the demand for 7nm is driving expected initial tape-outs from fabs by the end of 2017 – with initial volumes kicking off in 2018 and ramping […]
Live 14nm 2.5D/HBM2/SerDes Seminar, presented by Samsung, ASE, eSilicon, Rambus and Northwest Logic
https://www.rambus.com/northwest-logic-live-14nm-2-5dhbm2serdes-seminar-presented-samsung-ase-esilicon-rambus-northwest-logic-2/The seminar, presented live in Tokyo and Shanghai, will showcase a complete FinFET HBM2 supply chain solution Tokyo, Japan and Shanghai, China — November 16, 2017 — Samsung Electronics, ASE Group, eSilicon, Rambus and Northwest Logic have joined forces to offer a complete FinFET-based high-bandwidth memory (HBM) supply chain solution. HBM2 is a JEDEC-defined standard that […]
The role of persistent memory in the evolving data center
https://www.rambus.com/blogs/the-role-of-persistent-memory-in-the-evolving-data-center/DDR5 Ann Steffora Mutschler recent penned an article for Semiconductor Engineering that explores the role of new memory technology in the evolving data center. For example, DDR5 is expected to offer significant improvements over previous iterations of DRAM, including doubling the bandwidth and density over DDR4, as well as facilitating optimized channel efficiency. Nevertheless, DDR5 […]
Fujisoft Showcasing Northwest Logic’s Products at the Embedded/IoT Technology Conference 2017 in Japan
https://www.rambus.com/northwest-logic-fujisoft-showcasing-products-embeddediot-technology-conference-2017-japan/Beaverton, Oregon – October 17, 2017 Fujisoft, a Northwest Logic representative in Japan, will be showcasing Northwest Logic’s products at the Embedded/IoT Technology 2017 conference. The conference runs from Nov 15-17 at the Pacifico Yokohama Exhibition Hall A. For more information on the conference, contact Fujisoft or Northwest Logic for more information on Northwest Logic’s […]
Rambus delivers high-speed SerDes solutions on GLOBALFOUNDRIES FX-14 ASIC platform
https://www.rambus.com/blogs/rambus-delivers-high-speed-serdes-solutions-on-globalfoundries-fx-14-asic-platform/Rambus’ silicon-proven, high-speed SerDes solutions Rambus is now offering a suite of silicon-proven, high-speed SerDes solutions developed for the GLOBALFOUNDRIES high-performance FX-14™ ASIC platform. The suite includes 16G MPSL (multi-protocol serial link), 30G C2C (chip-to-chip) and 30G VSR (very short reach) PHYs. Rambus’ SerDes PHYs include a physical media attachment (PMA) hard macro and physical […]
Rambus highlights HBM2 PHY collaboration at GLOBALFOUNDRIES Technology Conference
https://www.rambus.com/blogs/rambus-highlights-hbm2-phy-collaboration-at-globalfoundries-technology-conference/HBM2 PHY We are showcasing our HBM2 PHY at the GLOBALFOUNDRIES Technology Conference at the Hyatt Regency Santa Clara (table #6). Designed for systems that require low latency and high bandwidth memory, our HBM2 PHY is built on GLOBALFOUNDRIES advanced 14nm Power Plus (LPP) process technology. The PHY is fully compliant with the JEDEC HBM2 […]
Controllers Newsletter – Q3 2017
https://www.rambus.com/controllers-newsletter-q3-2017/Northwest Logic, Rambus and GLOBALFOUNDRIES Demonstrate Complete, Silicon-Proven HBM2 Solution Northwest Logic, Rambus and GLOBALFOUNDRIES have demonstrated a complete, silicon-proven High Bandwidth Memory Gen2 (HBM2) solution. This solution utilizes the Rambus HBM2 PHY and Northwest Logic’s HBM2 Controller Core on the GLOBALFOUNDRIES 14nm FinFET (FX-14) process. The solution is fully compliant with the JEDEC HBM2 […]
5G connections to hit 1.4 billion by 2025
https://www.rambus.com/blogs/5g-connections-to-hit-1-4-billion-by-2025/Juniper Research analysts are forecasting 1.4 billion 5G connections by 2025, an increase from just 1 million – upon commercial launch of 5th generation wireless systems – in 2019. Unsurprisingly, the U.S. alone is expected to account for over 30% of global 5G IoT connections by 2025, with the highest number of 5G connections for […]
