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The DesignCon 2017 expo kicks off on February 2nd in Santa Clara. We’re at booth #833, showcasing our comprehensive suite of Ethernet, PCIe and DDRn IP solutions to solve today’s most challenging data center and networking needs. Rambus technical experts, executives and partners will also be holding a series of talks and technical training sessions […]
HBM2 Update From Northwest Logic and eSilicon eSilicon and Northwest Logic have been collaborating on 2.5D HBM designs for several years, starting with an FPGA, HBM1, organic interposer-based design more than five years ago. Since then, eSilicon has created a high-performance HBM PHY and taped out several multi-project wafer runs for silicon IP validation, improved […]
Ed Sperling of Semiconductor Engineering notes that power has always been a “global concern” in the design process because it affects every part of a chip. Nevertheless, partitioning for power rather than functionality or performance has not, historically, been seriously considered, although the status quo is beginning to change. For example, says Sperling, the increasing use […]
SK hynix, Inc., Amkor Technology, eSilicon, Northwest Logic and Avery Design Systems have joined forces to offer a complete High Bandwidth Memory (HBM) supply chain solution. HBM is a JEDEC-defined standard that utilizes 2.5D technology to interconnect a SoC and a HBM memory stack. To learn more about the Rambus HBM2E Controller, click here.
HBM Controller Core has been Hardware Validated Northwest Logic’s HBM Controller Core has now been hardware validated using a platform from eSilicon which consists of a Xilinx Virtex-7, SK Hynix Gen1 HBM Device and an organic interposer. This platform performs error-free, high-performance transfers between the controller and the HBM. The HBM Controller Core supports all […]
LabStation Validation Platform Contact Us Bring-up and validation of the advanced SoCs is increasingly difficult in today’s fast-paced technology lifecycle. Developed with these challenges in mind, the LabStation platform includes software and hardware to provide a straightforward and accurate method for testing chips and systems. ContactProduct Brief How the LabStation Platform works Design complexity for […]
We make high-performance, low-power memory and serial link interface chips and IP cores to meet the needs of increasingly diverse enterprise and mobile applications.
Frank Ferro, senior director of product marketing at Rambus, recently told SemiconductorEngineering’s Ed Sperling that he was looking forward to seeing what the company could do for next-gen DDR5 as well as evolving high-bandwidth memory (HBM) interfaces. “The goal is to start to bring the power down through things like better signaling technology for DDR5,” […]
A recent KitGuru report suggests AMD has designed its upcoming Radeon R9 380X with high bandwidth memory, or HBM, a next-gen stacked DRAM memory standard. “Although HBM provides DDR3 – like bit rate per pin (HBM1=1GHz, HBM2=2GHz), the standard more than compensates with its channel of 128 bits each,” Loren Shalinsky, a Strategic Development Director […]
A recent KitGuru report suggests AMD has designed its upcoming Radeon R9 380X with high bandwidth memory, or HBM, a next-gen stacked DRAM memory standard. Read first our primer on: HBM2E Implementation & Selection – The Ultimate Guide » “Although HBM provides DDR3 – like bit rate per pin (HBM1=1GHz, HBM2=2GHz), the standard more than […]