At Rambus, we create cutting-edge semiconductor and IP products, spanning memory and interfaces to security, smart sensors and lighting.
Found 142 Results
GDDR6 Controller
https://www.rambus.com/interface-ip/gddr/gddr6-controller/GDDR6 Controller Contact Us The Rambus GDDR6 controller core is designed for use in applications requiring high memory throughput including graphics, advanced driver assistance systems (ADAS), data center and artificial intelligence (AI). Secure Site Login ContactProduct Brief How a 24G GDDR6 Memory Interface Subsystem works Originally designed for graphics applications, GDDR6 is a high-performance memory […]
HBM2E Controller
https://www.rambus.com/interface-ip/hbm/hbm2e-controller/HBM2E Controller Contact Us The Rambus HBM2E memory controller IP is designed for use in applications requiring high memory throughput including performance-intensive applications in AI, HPC and graphics. Secure Site Login ContactProduct Brief The HBM2E Interface Subsystem HBM2E is a high-performance memory that features reduced power consumption and a small form factor. It combines a […]
Rambus Reports Third Quarter 2019 Financial Results
https://www.rambus.com/third-quarter-2019-financial-results/Great quarter, exceeding expectations; GAAP revenue of $57.4 million; licensing billings of $63.1 million, product revenue of $21.4 million, and contract and other revenue of $16.6 million $25.6 million in cash provided by operating activities Refocused business on semiconductor with completed sale of payments and ticketing business to Visa Expanded silicon IP offerings with acquisition […]
Chiplets keep the scaling of integrated circuits (ICs) rolling
https://www.rambus.com/blogs/chiplets-keep-the-scaling-of-integrated-circuits-ics-rolling/As data grows at an accelerating pace, more compute power and bandwidth are required to process this data, driving the need for larger and more complex system on chips (SoCs). This is particularly true at a time when our old friend Moore’s Law has lost a step. However, as the complexity of SOCs increases, so […]
Rambus Announces Portfolio of Advanced Memory and SerDes PHYs on TSMC N7 Process
https://www.rambus.com/rambus-announces-portfolio-of-advanced-memory-and-serdes-phys-on-tsmc-n7-process/Highlights: GDDR6, HBM2, and 112G Long Reach (LR) interfaces designed for TSMC’s industry-leading N7 process technology expand Rambus’ leading-edge memory and SerDes PHY offerings Portfolio enables critical building blocks for next-generation data center, networking, wireless 5G, high-performance computing (HPC), advanced driver assistance systems (ADAS), artificial intelligence (AI) and machine learning (ML) applications SUNNYVALE, Calif. and […]
HBM2 or GDDR6?
https://www.rambus.com/blogs/hbm2-or-gddr6/Earlier this month, Semiconductor Engineering editor-in-chief Ed Sperling hosted an industry roundtable to discuss new DRAM options and considerations. Frank Ferro, our senior director of product management, represented Rambus, alongside participants from Cadence, Synopsys and Samsung Electronics. Read first our primer on: HBM2E Implementation & Selection – The Ultimate Guide » As Ferro points out, […]
Part 2: Steven Woo Explains GDDR6 – HBM2 Design Tradeoffs
https://www.rambus.com/blogs/part-2-steven-woo-explains-gddr6-hbm2-design-tradeoffs/In part one of this two-part series, Steven Woo, Rambus fellow and distinguished inventor, speaks with Ed Sperling of Semiconductor Engineering about the basic design tradeoffs between GDDR6 and HBM2. To illustrate the differences between the two memory types, Woo highlights a 256 gigabyte per second memory system built using either GDDR6 or HBM2. In […]
Rambus Completes Acquisition of Northwest Logic, Extending Leadership in Interface IP
https://www.rambus.com/rambus-completes-acquisition-of-northwest-logic-extending-leadership-in-interface-ip/Highlights: Digital controller IP complements existing portfolio of high-speed interface PHYs Expands solutions for automotive, data center, artificial intelligence (AI), machine learning (ML) and communications applications Combined offerings, including HBM2, GDDR6, DDR4 and PCI Express (PCIe), create one-stop-shop for SoC designers SUNNYVALE, Calif. – Aug. 27, 2019 – Rambus Inc. (NASDAQ: RMBS), a premier silicon […]
Rambus Completes Acquisition of Northwest Logic, Extending Leadership in Interface IP
https://www.rambus.com/rambus-completes-acquisition-of-northwest-logic/Highlights: Digital controller IP complements existing portfolio of high-speed interface PHYs Expands solutions for automotive, data center, artificial intelligence (AI), machine learning (ML) and communications applications Combined offerings, including HBM2, GDDR6, DDR4 and PCI Express (PCIe), create one-stop-shop for SoC designers SUNNYVALE, Calif. – Aug. 27, 2019 – Rambus Inc. (NASDAQ: RMBS), a premier silicon […]
Part 1: Steven Woo Explains GDDR6 – HBM2 Design Tradeoffs
https://www.rambus.com/blogs/part-1-steven-woo-explains-gddr6-hbm2-design-tradeoffs/Steven Woo, Rambus fellow and distinguished inventor, recently spoke with Ed Sperling of Semiconductor Engineering about designing systems with GDDR6 and HBM2. As Woo emphasizes, understanding engineering tradeoffs are an important part of deciding how to best match a system with the most appropriate memory. Read first our primer on: HBM2E Implementation & Selection – […]
