Home > Search
Found 3545 Results
Rambus has announced functional silicon of a double data rate (DDR) server DIMM (dual inline memory module) buffer chipset prototype targeted for next-gen DDR5 memory technology. According to Luc Seraphin, senior vice president and general manager of the Rambus Memory and Interfaces Division, the announcement marks a key milestone for both Rambus and the semiconductor […]
The Rambus DDR5 Server DIMM buffer chipset is the industry’s first functional silicon targeted for next-generation DDR5. Our chips are designed to enable high-capacity, high-speed and robust memory solutions for tomorrow’s most demanding enterprise and data center applications.
Provides data center architects early path to next-generation memory speeds SUNNYVALE, Calif. – Sept. 20, 2017 – Rambus Inc. (NASDAQ: RMBS) today announced functional silicon of a double data rate (DDR) server DIMM (dual inline memory module) buffer chipset prototype for the next generation DDR5 memory technology. This represents a key milestone for Rambus and the industry’s […]
Rambus recently interviewed a number of prominent industry experts at the Mobey Forum about the key ingredients for a successful mobile wallet. According to Kristian Luoma of the OP Financial Group, a mobile wallet should be more than simply trustworthy and secure. “[A mobile wallet] needs to be trustworthy and secure for sure, but those are […]
eMarketer analysts are projecting that the value of U.S. proximity mobile payment transactions will total $49.29 billion in 2017, up 78.1% from last year. Although the growth rate is expected to remain in double digits, it will slow to 23.9% in 2021, when mobile phones will be used to pay for $189.97 billion worth of goods […]
Get to know your Silicon Valley Chapter President: Jerome Nadel. Jerome is the Chief Marketing Officer at Rambus and has been a CMO Club Member since July 2014. He is active in Chapter Dinners, CMO Club Summits, led CMO roundtable discussions and was a 2016 CMO Awards Finalist. You can connect with Jerome here on Twitter and LinkedIn.
Semiconductor Engineering’s Ed Sperling recently penned an article about the challenges of IP reuse. The basic business proposition for third-party IP, says Sperling, is that it’s cheaper, faster and less problematic to buy rather than build. [“However], things haven’t exactly worked out according to plan, either for companies that license IP or those that develop […]
David Worthington, VP of Business Development at Rambus Technical body EMVCo launched version two of its EMV® Payment Tokenization Specification – Technical Framework in September. The market has evolved rapidly since v1.0 was launched in 2014 – to address the needs of digital payments including eCommerce, and minimize the fraud risk associated to an exposure […]
EMV Payment Tokenization Specification – Technical Framework EMVCo has published version two of its EMV Payment Tokenization Specification. The technical framework document – which can be downloaded here – addresses the adoption of payment token use cases in e-commerce beyond existing card-on-file and explores how payment tokens can be controlled within a single payments channel. […]
We will be showcasing our IoT security, mobile payment and smart ticketing solutions at Mobile World Congress Americas (MWCA 2017) in San Francisco on September 12-14, 2017. Come visit us at stand N.319 in Moscone’s North Hall, where you can check out our CryptoManager IoT Device Management service, Unified Payment Platform and various smart ticketing […]
