SerDes PHYs
32G Multi-Protocol SerDes PHY Out the Gate
Hemant Dhulla, vice president and general manager of IP Cores at Rambus says that the newly announced 28G and 32G SerDes from Rambus “will be
February 22, 2019
At Rambus, we create cutting-edge semiconductor and IP products, providing industry-leading chips and silicon IP to make data faster and safer.
SerDes PHYs
Rambus at the Samsung Foundry Forum
In 2005, Samsung launched its Foundry business to provide leading-edge technology to the broader market. Based on accumulated technology leadership, Samsung successfully developed the foundry
March 11, 2019
SerDes PHYs
Understanding HBM design challenges
HBM2 @ 256GB/s As Semiconductor Engineering’s Ann Steffora Mutschler observes, high-bandwidth memory (HBM) enables lower power consumption per I/O, as well as higher bandwidth memory
November 18, 2020
SerDes PHYs
Ramping 400 Gbps Ethernet and beyond
From 400 Gbps to 800 Gbps A recently published report by the Dell’Oro Group states that 400 Gbps is expected to comprise 20 percent of
March 11, 2019
SerDes PHYs
The future of NRZ vs PAM4
EDN’s Martin Rowe wrote an article that explores various industry viewpoints – shared at a DesignCon 2018 panel – about the future of NRZ vs PAM4
September 13, 2021
Interface IP
The importance of PCI Express 4.0 in the data center
Niraj Mathur, VP of high speed interface products at Rambus, recently penned an article for Semiconductor Engineering that explores the importance of PCI Express 4.0 in
October 29, 2024
