At Rambus, we create cutting-edge semiconductor and IP products, providing industry-leading chips and silicon IP to make data faster and safer.
Mohit Gupta, senior director of product marketing for Rambus’ Memory and Interfaces Division, recently penned an article for Semiconductor Engineering that explores the connection between SerDes and terabit
Rambus is currently collaborating with PLDA and Avery Design Systems Inc. to offer a comprehensive, silicon-proven PCI Express (PCIe) 4.0 solution, with backward compatibility to
Rambus has confirmed that its recently launched 56G SerDes PHY will be developed on Samsung’s 10nm LPP (Low-Power Plus) process technology. According to Luc Seraphin,
ZDNet journalist Cho Mu-Hyun reports that Samsung has confirmed a successful network processor tape-out based on the company’s 14LPP (Low-Power Plus) process technology in close
Maintaining signal integrity has become increasingly difficult for SerDes designers at 28Gbps, 56Gbps and beyond. After nearly fifty years, NRZ technology continues to pose significant
Samsung Electronics has announced a successful network processor tape-out based on the company’s 14LPP (Low-Power Plus) process technology in close collaboration with eSilicon and Rambus.
