
Accelerating AI/ML applications in the data center with HBM3
Semiconductor Engineering Editor in Chief Ed Sperling recently spoke with Frank Ferro, Senior Director of Product Management at Rambus, about accelerating AI/ML applications in the
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Semiconductor Engineering Editor in Chief Ed Sperling recently spoke with Frank Ferro, Senior Director of Product Management at Rambus, about accelerating AI/ML applications in the
2022 has seen major updates to two standards critical to the future evolution of the data center: PCI Express® (PCIe®) and Compute Express Link™ (CXL™).
The CXL™ Consortium (of which Rambus is a member) has now released the 3.0 specification of the Compute Express Link™ (CXL) standard. CXL 3.0 introduces
While the PCI-SIG has announced that the release of the PCI Express® 6.0 (PCIe 6.0) specification should arrive in 2022, Rambus is already addressing the needs of early adopters looking for the most advanced PCIe 6.0
PCIe 4.0 is the next evolution of the ubiquitous and general purpose PCI Express I/O specification. It’s also known as PCIe Gen 4 and it
Suresh Andani, senior director of product marketing at Rambus, has written an article for Semiconductor Engineering that takes a closer look at why data center