Blog Category: SerDes PHYs

EDN’s Martin Rowe wrote an article that explores various industry viewpoints – shared at a DesignCon 2018 panel – about the future of NRZ vs PAM4

Niraj Mathur, VP of high speed interface products at Rambus, recently penned an article for Semiconductor Engineering that explores the importance of PCI Express 4.0 in

Rambus’ silicon-proven, high-speed SerDes solutions Rambus is now offering a suite of silicon-proven, high-speed SerDes solutions developed for the GLOBALFOUNDRIES high-performance FX-14™ ASIC platform. The

Semiconductor Engineering’s Anna Steffora Mutschler has written an article about how peak power poses a serious design challenge for chips, electronic systems and data centers.

Semiconductor Engineering’s Ed Sperling recently penned an article about the challenges of IP reuse. The basic business proposition for third-party IP, says Sperling, is that

Juniper Research analysts forecast that wireless VR headsets (smartphone-based and standalone) data consumption will increase by over 650% over the next 4 years, from nearly