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Join us at COMPUTEX 2025 in Taipei, Taiwan! We hope you will join us at COMPUTEX 2025! Join us and learn how our cutting-edge chips for server and client memory modules and robust IP solution offerings are powering the next wave of AI innovation. Our technologies are designed to meet the ever-growing performance and efficiency […]


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AI training models are growing in both size and sophistication at a breathtaking rate, requiring ever greater bandwidth and capacity. With its unique 2.5D/3D architecture, HBM4 can deliver Terabytes per second of bandwidth and unprecedented capacity in an extremely compact form factor. Join Kevin Yee from Samsung and Nidish Kamath from Rambus discuss the design […]