At Rambus, we create cutting-edge semiconductor and IP products, spanning memory and interfaces to security, smart sensors and lighting.
Found 142 Results
Rambus and Northwest Logic Certify Interoperability of HBM2 Interface Solution for High-performance Networking and Data Center Applications
https://www.rambus.com/northwest-logic-rambus-certify-hbm2-interoperability/Integrated HBM2 PHY and Memory Controller provide validated, standards-compliant memory subsystem with superior signal integrity and reliability SUNNYVALE, Calif. – Aug. 28, 2017 – Rambus Inc. (NASDAQ: RMBS), an innovator in semiconductor and IP products, today announced validated interoperability between its HBM2 PHY and Northwest Logics’ HBM2 Memory Controller Core. The solution builds on the growing ecosystem […]
Rambus and Northwest Logic certify HBM2 interoperability
https://www.rambus.com/blogs/rambus-and-northwest-logic-certify-hbm2-interoperability/Rambus has validated interoperability between its HBM2 PHY and Northwest Logics’ HBM2 Memory Controller Core. The combined HBM2 solution is designed to support high-performance networking and server applications in the data center and communications markets that require the maximum amount of bandwidth available provided by HBM2. According to Luc Seraphin, senior vice president and general […]
Rambus and Northwest Logic Certify Interoperability of HBM2 Interface Solution for High-performance Networking and Data Center Applications
https://www.rambus.com/rambus-and-northwest-logic-certify-interoperability-of-hbm2-interface-solution-for-high-performance-networking-and-data-center-applications/Integrated HBM2 PHY and Memory Controller provide validated, standards-compliant memory subsystem with superior signal integrity and reliability SUNNYVALE, Calif. – Aug. 23, 2017 – Rambus Inc. (NASDAQ: RMBS), an innovator in semiconductor and IP products, today announced validated interoperability between its HBM2 PHY and Northwest Logics’ HBM2 Memory Controller Core. The solution builds on the growing ecosystem […]
Bolstering bandwidth and capacity with new memory tech
https://www.rambus.com/blogs/bolstering-bandwidth-and-capacity-with-new-memory-tech/Rambus’ John Eble and Frank Ferro recently penned an article for Data Center Dynamics that explores how new memory technology can help bolster both bandwidth and capacity in the data center. As the two note, DDR4 delivers up to 1.5x performance improvement over DDR3, while reducing power by an impressive 25% on the memory interface. […]
GLOBALFOUNDRIES highlights HBM2 PHY collaboration with Rambus
https://www.rambus.com/blogs/globalfoundries-highlights-hbm2-phy-collaboration-with-rambus/2Tbps multi-lane HBM2 PHY Earlier this month, GLOBALFOUNDRIES demonstrated silicon functionality of a 2.5D packaging solution for its high-performance 14nm FinFET FX-14 integrated design system for application-specific integrated circuits (ASICs). The 2.5D ASIC solution includes a stitched interposer capability to overcome lithography limitations and a two terabits per second (2Tbps) multi-lane HBM2 PHY, developed in […]
Wireless VR to strain data networks
https://www.rambus.com/blogs/wireless-vr-to-strain-data-networks/Juniper Research analysts forecast that wireless VR headsets (smartphone-based and standalone) data consumption will increase by over 650% over the next 4 years, from nearly 2,800PB (Petabytes) in 2017 to over 21,000PB in 2021. Moreover, when combined with traffic generated by VR headsets tethered to PCs and consoles, data consumption is expected to reach over […]
5G edge computing in a post-GIGO world
https://www.rambus.com/blogs/5g-edge-computing-in-a-post-gigo-world/There are many who would dispute the notion that we are living in a post-GIGO (Garbage In, Garbage Out) world. Nevertheless, it is undeniable that the ubiquitous Internet of Things (IoT) has created a digital tsunami of valuable data generated by a wide range of devices, systems and IoT endpoints such as vehicles, wearables, smartphones […]
GLOBALFOUNDRIES demonstrates 2.5D high-bandwidth memory (HBM) solution
https://www.rambus.com/blogs/globalfoundries-demonstrates-2-5d-high-bandwidth-memory-hbm-solution/GLOBALFOUNDRIES has demonstrated silicon functionality of a 2.5D packaging solution for its high-performance 14nm FinFET FX-14™ integrated design system for application-specific integrated circuits (ASICs). According to Kevin O’Buckley, VP of ASIC product development at GF, the 2.5D ASIC solution includes a stitched interposer capability to overcome lithography limitations and a two terabits per second (2Tbps) […]
HBM2 continues to ramp
https://www.rambus.com/blogs/hbm2-continues-to-ramp/Samsung ramps volume production of 8GB HBM2 Earlier this month, Samsung confirmed an increase in production volume of its 8-gigabyte (GB) High Bandwidth Memory-2 (HBM2) to meet growing market needs across a wide range of applications including artificial intelligence, HPC (high-performance computing), advanced graphics, network systems and enterprise servers. Image Credit: Samsung According to Samsung, […]
Controllers Newsletter – Q2 2017
https://www.rambus.com/controllers-newsletter-q2-2017/Northwest Logic’s MIPI CSI-2 Controllers are Widely Used in Automotive Designs Automobiles are increasingly using low cost, high performance MIPI Camera Serial Interface (CSI-2) based cameras for an enhanced driver experience (backup cameras, collision detection, autonomous driving, etc.). Northwest Logic’s receive and transmit CSI-2 Controller Cores are being used to transport video between in-car cameras […]
