At Rambus, we create cutting-edge semiconductor and IP products, providing industry-leading chips and silicon IP to make data faster and safer.
Found 3637 Results
EE Times says DDR5 is running in Rambus’ labs
https://www.rambus.com/blogs/ee-times-says-ddr5-is-running-in-rambus-labs/Rick Merritt of the EE Times reports that Rambus has working silicon in its labs for DDR5, which the journalist describes as the next major interface for DRAM dual in-line memory modules (DIMMs). The register clock drivers and data buffers, says Merritt, could help double the throughput of main memory in servers, probably starting in […]
DDR5 Runs in Rambus’ Labs
https://www.eetimes.com/document.asp?doc_id=1332322#new_tabRambus has working silicon in its labs for DDR5, the next major interface for DRAM dual in-line memory modules (DIMMs). The register clock drivers and data buffers could help double the throughput of main memory in servers, probably starting in 2019 — and they are already sparking a debate about the future of computing.
Rambus highlights HBM2 PHY collaboration at GLOBALFOUNDRIES Technology Conference
https://www.rambus.com/blogs/rambus-highlights-hbm2-phy-collaboration-at-globalfoundries-technology-conference/HBM2 PHY We are showcasing our HBM2 PHY at the GLOBALFOUNDRIES Technology Conference at the Hyatt Regency Santa Clara (table #6). Designed for systems that require low latency and high bandwidth memory, our HBM2 PHY is built on GLOBALFOUNDRIES advanced 14nm Power Plus (LPP) process technology. The PHY is fully compliant with the JEDEC HBM2 […]
Next-gen server DIMM buffer chipset targets DDR5 memory
https://www.rambus.com/blogs/next-gen-server-dimm-buffer-chipset-targets-ddr5-memory/Rambus has announced functional silicon of a double data rate (DDR) server DIMM (dual inline memory module) buffer chipset prototype targeted for next-gen DDR5 memory technology. According to Luc Seraphin, senior vice president and general manager of the Rambus Memory and Interfaces Division, the announcement marks a key milestone for both Rambus and the semiconductor […]
DDR5 DIMM Chipset
https://www.rambus.com/memory-interface-chips/ddr5-dimm-chipset/The Rambus DDR5 Server DIMM buffer chipset is the industry’s first functional silicon targeted for next-generation DDR5. Our chips are designed to enable high-capacity, high-speed and robust memory solutions for tomorrow’s most demanding enterprise and data center applications.
Rambus Announces Industry’s First Functional Silicon of Server DIMM Buffer Chipset Targeted for Next-generation DDR5
https://www.rambus.com/rambus-announces-next-gen-ddr5/Provides data center architects early path to next-generation memory speeds SUNNYVALE, Calif. – Sept. 20, 2017 – Rambus Inc. (NASDAQ: RMBS) today announced functional silicon of a double data rate (DDR) server DIMM (dual inline memory module) buffer chipset prototype for the next generation DDR5 memory technology. This represents a key milestone for Rambus and the industry’s […]
Key ingredients for a successful mobile wallet
https://www.rambus.com/blogs/key-ingredients-for-a-successful-mobile-wallet/Rambus recently interviewed a number of prominent industry experts at the Mobey Forum about the key ingredients for a successful mobile wallet. According to Kristian Luoma of the OP Financial Group, a mobile wallet should be more than simply trustworthy and secure. “[A mobile wallet] needs to be trustworthy and secure for sure, but those are […]
U.S. proximity mobile payment transactions to total $49.29 billion in 2017
https://www.rambus.com/blogs/u-s-proximity-mobile-payment-transactions-to-total-49-29-billion-in-2017/eMarketer analysts are projecting that the value of U.S. proximity mobile payment transactions will total $49.29 billion in 2017, up 78.1% from last year. Although the growth rate is expected to remain in double digits, it will slow to 23.9% in 2021, when mobile phones will be used to pay for $189.97 billion worth of goods […]
Welcome your new Silicon Valley Chapter President, Jerome Nadel of Rambus!
https://thecmoclub.com/news-item/silicon-valley-chapter-pres-jerome-nadel/?utm_campaign=C_Clubhouse%20Content&utm_content=60472193&utm_medium=social&utm_source=twitter#new_tabGet to know your Silicon Valley Chapter President: Jerome Nadel. Jerome is the Chief Marketing Officer at Rambus and has been a CMO Club Member since July 2014. He is active in Chapter Dinners, CMO Club Summits, led CMO roundtable discussions and was a 2016 CMO Awards Finalist. You can connect with Jerome here on Twitter and LinkedIn.
The challenges of IP reuse
https://www.rambus.com/blogs/the-challenges-of-ip-reuse/Semiconductor Engineering’s Ed Sperling recently penned an article about the challenges of IP reuse. The basic business proposition for third-party IP, says Sperling, is that it’s cheaper, faster and less problematic to buy rather than build. [“However], things haven’t exactly worked out according to plan, either for companies that license IP or those that develop […]
