Samsung and eSilicon tape out 14nm network processor with Rambus 28G SerDes solution

This entry was posted on Thursday, March 23rd, 2017.

Samsung Electronics has announced a successful network processor tape-out based on the company’s 14LPP (Low-Power Plus) process technology in close collaboration with eSilicon and Rambus. The tape-out was made possible by Samsung’s cutting-edge foundry process and design infrastructure for network applications, eSilicon’s complex ASIC and 2.5D design capability with its IP solutions, and Rambus’ high-speed 28G SerDes solution.


“Networking OEMs are looking for high-quality leadership IP suppliers that can bring 28G backplane SerDes in advanced FinFET process nodes to market,” said Luc Seraphin, senior VP and general manager of Rambus Memory and Interfaces Division. “Our success with Samsung and eSilicon is a testament that these industry-leading solutions are attainable when you bring leading companies together. This is the first of several other offerings we plan to bring to networking and enterprise ASIC markets around the globe.”

According to Ryan Lee, VP of Foundry Marketing team at Samsung Electronics, Samsung’s 14LPP process technology, based on 3D FinFET structure, has already been proven for its high performance and manufacturability through mass production track record. The next generation process for network application is 10LPP (Low-Power Plus) process which is based on 10LPE (Low-Power Early) that moved into mass production last year for the first time in the industry. 10LPP process’ mass production will be started in the second half of 2017.

In addition to the above-mentioned tape-out, Samsung named its newly developed full 2.5D turnkey solution, which connects a logic chip and HBM2 memory with interposer, as the I-Cube™ (Interposer-Cube) solution. This 14LPP network process chip is the first product that Samsung applied its I-Cube™ solution together with Samsung’s HBM2 memory. The I-Cube™ solution will be essential to network applications for high-speed signaling and is expected to be adopted into other applications such as computing, servers and AI in the near future.

“I am delighted to announce [the] 14nm network processor tape-out,” said Lee. “This successful product tape-out was combined with eSilicon’s proven design ability in the network area and Rambus’ expertise in SerDes and Samsung’s robust process technology, along with [the] I-Cube solution. This collaboration model is a very unique solution which will have a very big impact in the network foundry segment. Samsung will keep developing its network foundry solution to be a meaningful total network solution provider aligned with our process roadmap from 14nm and 10nm to 7nm.”