Rambus

At Rambus, we create cutting-edge semiconductor and IP products, spanning memory and interfaces to security, smart sensors and lighting.

Home > Press Releases > Interface IP > Memory PHYs > Page 3

Memory PHYs

Rambus Introduces High Bandwidth Memory PHY on GLOBALFOUNDRIES FX-14™ ASIC Platform using 14nm LPP Process Technology

High-performance, power-efficient memory solution designed for today’s data centers

SUNNYVALE, Calif. – February 7, 2017 – Rambus Inc. (NASDAQ: RMBS) today announced the availability of its High Bandwidth Memory (HBM) Gen2 PHY developed for GLOBALFOUNDRIES high-performance FX-14TM ASIC Platform. Built on the GLOBALFOUNDRIES 14nm FinFET (14LPP) process technology, the Rambus HBM PHY is aimed at networking and data center applications and designed for systems that require low latency and high bandwidth memory. This PHY is fully compliant with the JEDEC HBM2 standard and supports data rates up to 2000 Mbps per data pin, enabling a total bandwidth of 256 GB/s to meet the needs of today’s most data-intensive tasks.

“Data center needs are continuously changing and we are at the forefront of delivering memory interface technology designed to meet today’s most demanding workloads,” said Luc Seraphin, senior vice president and general manager of the Rambus Memory and Interfaces division. “Through our collaboration with GLOBALFOUNDRIES, we are delivering a comprehensive and robust solution for high-performance data center and networking applications. Our HBM offering will allow data center solution developers to bring high performance memory closer to the CPU, thus reducing latency and improving the system throughput.”

“With the rise of cloud computing and the growing needs of Big Data, the computing power of data centers is burdened more than ever and hardware manufacturers are being called upon to deliver new solutions that can meet these challenges,” said Kevin O’Buckley, vice president product development GLOBALFOUNDRIES. “Working together with Rambus enables us to provide ASIC solutions to our customers with increased memory capacity and bandwidth, with improved power efficiency. This HBM innovation complements other advanced chip to chip interfaces in our ASIC platform, including our industry leading 56G Long Reach SerDes technology.”

The Rambus HBM PHY delivers high performance with lower power consumption when compared to other memory solutions. It combines 2.5D packaging with a wider interface (1024 bits) at a lower clock speed, which results in a higher overall throughput while remaining energy efficient for even the most high-performance computing applications. Rambus experts perform complete signal and power integrity analysis on the entire 2.5D systems to ensure all signal and thermal requirements are met.

The HBM PHY is another key component in Rambus’ memory and SerDes high-speed interface IP portfolio for networking and data center applications. For additional information on Rambus Memory and Interfaces solutions, please visit rambus.com/memory-and-interfaces.

Follow Rambus:
Company website: rambus.com
Rambus blog: rambusblog.com
Twitter: @rambusinc
LinkedIn: www.linkedin.com/company/rambus
Facebook: www.facebook.com/RambusInc 

Press contact:

Agnes Toan
Corporate Communications
(408) 462-8905
atoan@rambus.com

Rambus Signs Patent License Agreement with Winbond

Broad agreement addresses device and cloud demands for high bandwidth, low latency, efficient memory solutions

SUNNYVALE, Calif. – January 16, 2017 – Rambus Inc. (NASDAQ:RMBS) today announced it has signed a broad five-year patent license agreement with Winbond Electronics Corporation, a worldwide leading supplier of specialty memory. This agreement covers the use of Rambus patented memory solutions, including server DIMM chipsets, for Winbond products through 2021.

“In today’s data intensive applications, computing memory solutions must be more efficient, deliver higher levels of bandwidth and lower latency to solutions to meet the demands of the market,” said Luc Seraphin, general manager of the Interface Division at Rambus. “This collaborative partnership with Winbond provides critical memory and interface technologies that address the needs and requirements to run effective data centers.”

Rambus develops high-performance, low-power memory and SerDes interface chips and IP cores to meet the needs of increasingly diverse enterprise and mobile applications. Rambus also drives innovations in silicon-to-cloud security, making digital products safer and better.

For additional information on Rambus products and solutions, please visit rambus.com.

Follow Rambus:
Company website: rambus.com
Rambus blog: rambusblog.com
Twitter: @rambusinc
LinkedIn: www.linkedin.com/company/rambus
Facebook: www.facebook.com/RambusInc

About Rambus Inc.
Rambus creates innovative hardware and software technologies, driving advancements from the data center to the mobile edge. Our chips, customizable IP cores, architecture licenses, tools, software, services, training and innovations improve the competitive advantage of our customers. We collaborate with the industry, partnering with leading ASIC and SoC designers, foundries, IP developers, EDA companies and validation labs. Our products are integrated into tens of billions of devices and systems, powering and securing diverse applications, including Big Data, Internet of Things (IoT), mobile, consumer and media platforms. At Rambus, we are makers of better. For more information, visit rambus.com.

About Winbond Electronics Corp.
Winbond Electronics Corporation is a leading global supplier of semiconductor memory solutions, headquartered in Taichung, Taiwan.  Winbond’s major products include Specialty DRAM, Mobile DRAM, and Code Storage Flash Memory with Winbond’s memory business revenues in 2015 close to US$1 billion. Winbond has approximately 2,700 employees worldwide, with offices in Taiwan, Hong Kong, China, Japan, Israel, and the USA.  For more information, please visit winbond.com.

Rambus Signs License Agreement with Xilinx

Broad agreement includes memory controller, SerDes, and security technologies

SUNNYVALE, Calif. – October 3, 2016 – Rambus Inc. (NASDAQ:RMBS) today announced it has signed a license agreement with Xilinx Inc., the world’s leading provider of All Programmable FPGAs, SoCs, MPSoCs and 3D ICs, covering Rambus’ patented memory controller, SerDes, and security technologies. In addition, the two companies will look to evaluate potential collaboration on the use of Rambus’ CryptoManager platform, and Rambus will also explore the use of Xilinx FPGAs in the Rambus Smart Data Acceleration (SDA) research program. Specific terms of the agreement are confidential.

“As a leader in the FPGA space, Xilinx has built compelling solutions that are necessary for the growing acceleration needs in the data center,” said Dr. Ron Black, chief executive officer of Rambus. “Through collaboration, we also see great potential for our CryptoManager platform to serve as the secure foundation that enables remote, dynamic activation of features once the devices are deployed in the field. We look forward to the possibilities of engaging in these programs with the Xilinx teams and providing innovative solutions to our shared customers.”

The Rambus CryptoManager security platform creates a trusted path from the SoC manufacturing supply chain to downstream service providers with a complete silicon-to-cloud security solution. The Rambus SDA research program provides a platform to investigate near data processing system architectures that include software, firmware, FPGAs and large amounts of memory. To learn more about the Rambus solutions tailored to support the needs of the data center, visit rambus.com/memory-and-interfaces. For more information on Rambus security solutions, visit rambus.com/security/.

Follow Rambus:
Company website: rambus.com
Rambus blog: rambusblog.com
Twitter: @rambusinc
LinkedIn: www.linkedin.com/company/rambus
Facebook: www.facebook.com/RambusInc

About Rambus Inc.
Rambus creates innovative hardware and software technologies, driving advancements from the data center to the mobile edge. Our chips, customizable IP cores, architecture licenses, tools, services, software, training and innovations improve the competitive advantage of our customers. We collaborate with the industry, partnering with leading ASIC and SoC designers, foundries, IP developers, EDA companies and validation labs. Our products are integrated into tens of billions of devices and systems, powering and securing diverse applications, including Big Data, Internet of Things (IoT), mobile, consumer and media platforms. At Rambus, we are makers of better. For more information, visit rambus.com.

Rambus Announces Silicon-proven R+ DDR4 PHY on GLOBALFOUNDRIES 14nm LPP Process for Networking and Data Center Applications

Production-ready PHY IP will address the high-performance needs of enterprise systems

SUNNYVALE, Calif. – July 26, 2016 – Rambus Inc. (NASDAQ:RMBS) today announced that it has developed an R+ DDR4 PHY on the GLOBALFOUNDRIES FX-14™ ASIC platform using the company’s most advanced 14nm Power Plus (LPP) process. As part of a comprehensive suite of memory and SerDes interface offerings for networking and data center applications, Rambus has achieved the first production-ready 3200 Mbps DDR4 PHY available on GLOBALFOUNDRIES power-performance optimized 14nm LPP process. The R+ DDR4 PHY is designed to meet the performance and capacity demands of the next wave of data center and networking markets.

“As we become more reliant on the cloud and the stresses placed on data centers continues to grow, the need for memory offerings that promise faster speeds and higher bandwidth has never been more important,” said Luc Seraphin, senior vice president and general manager of the Rambus Memory and Interfaces division. “Together with GLOBALFOUNDRIES, we have been able to develop the industry’s first DDR4 PHY on a 14nm LPP process running at 3200 Mbps and capable of achieving the performance requirements of next-generation systems.”

“GLOBALFOUNDRIES’ FX-14™ platform, based on our advanced 14nm LPP technology, is designed to support the memory intensive computing tasks in today’s most demanding enterprise applications,” said Kevin O’Buckley, vice president product development GLOBALFOUNDRIES. “At 3200 Mbps, the R+ DDR4/3 PHY delivers the maximum data rate supported by the standard enabling advanced functionality like simultaneous streaming of Ultra HD content. We look forward to continue collaborating with Rambus as we develop a fully-featured suite of memory products designed to ensure the best performance for today’s data centers.”

The Rambus R+ DDR4 PHY is DFI 4.0 compatible, providing easy integration, and enables customers to differentiate their offerings by providing industry-leading performance while maintaining full compatibility with industry standard DDR4, and DDR3/3L/3U interfaces. Designed for flexibility, the R+ DDR4 PHY delivers data rates from 800 to 3200 Mbps in multiple memory sub-system options including die down, DIMM, and 3DS. In addition, the PHY supports 16 – 72-bit interfaces, along with single and multi-rank configurations, allowing the end customer to optimize their design for performance, as well as both area and low power.

For more information on R+ DDR4 and our other memory PHYs, visit rambus.com/ddrnphys.

Follow Rambus:
Company website: rambus.com
Rambus blog: rambusblog.com
Twitter: @rambusinc
LinkedIn: www.linkedin.com/company/rambus
Facebook: www.facebook.com/RambusInc

About Rambus Memory and Interfaces Division (MID)

The Rambus Memory and Interfaces Division develops products and services that solve the power, performance, and capacity challenges of the mobile, connected device, and cloud computing markets. Rambus enhanced standards-compatible and custom memory and serial link solutions include chips, architectures, memory and chip-to-chip interfaces, DRAM, IP validation tools, and system and IC design services. Developed through our system-aware design methodology, Rambus products deliver improved time-to-market and first-time-right quality.

About Rambus Inc.

Rambus creates cutting-edge semiconductor and IP products, spanning memory and interfaces to security, smart sensors and lighting. Our chips, customizable IP cores, architecture licenses, software, tools, services, training and innovations improve the competitive advantage of our customers. We collaborate with the industry, partnering with leading ASIC and SoC designers, foundries, IP developers, EDA companies and validation labs. Our products are integrated into tens of billions of devices and systems, powering and securing diverse applications, including Big Data, Internet of Things (IoT), mobile, consumer and media platforms. At Rambus, we are makers of better. For more information, visit rambus.com.

 

Rambus Makes Server Memory Interface Chipset For Advanced Enterprise and Data Center Systems

New DDR4 RDIMM and LRDIMM Chipset Meets Growing Demands Of Big Data and Cloud Computing

SUNNYVALE, Calif. – August 17, 2015 – Rambus Inc. (NASDAQ:RMBS) today introduced the R+ DDR4 server memory chipset, RB26, for RDIMMs and LRDIMMs[i], delivering superior performance and capacity for both the enterprise and data center server markets. The first in a family of R+ chips, the RB26 is an enhanced, JEDEC-compliant memory module chipset designed to accelerate data-intensive applications, including real-time analytics, virtualization and in-memory computing, with increased speed, reliability and power-efficiency.

“At Rambus, we have a rich history of innovation and expertise in high-speed memory interface design – the introduction of this chipset is a natural progression that enables us to deliver maximum value to the industry,” said Dr. Ron Black, president and chief executive officer at Rambus. “Expanding our offer beyond IP into chips with standards-based offerings that feature leading-edge performance and advanced functionality amplifies our growth strategy and furthers our engagement with the market.”

According to the International Data Corporation’s (IDC) 2015 Worldwide DRAM Demand and Supply 1Q15–4Q16 and 2015–2019 analysis, which was led by Mario Morales, vice president of the semiconductors research program, the average DRAM capacity per server is projected to more than double in the next three years with penetration of DDR4 in the server market reaching 100 percent by 2019.

“Data centers and enterprise markets are under increased pressure to implement enhanced memory architectures that meet the capacity and bandwidth requirements to handle large amounts of complex data,” said Patrick Moorhead, president of Moor Insights & Strategy. “Rambus’ deep expertise in advanced memory designs makes them the newcomer to watch in the server memory chipset market.”

Features and Functionality

The RB26 DDR4 RDIMM and LRDIMM chipset includes a DR4 Register Clock Driver (RCD) and Data Buffer (DB) that feature:

  • JEDEC DDR4 Compliance: fully-compliant with the latest JEDEC DDR4 RCD and DB specifications at 2666 Mbps with built-in support for future data rates;
  • Industry-leading Performance and Margin: advanced I/O programmability and power management techniques allow for broad compatibility and increased efficiency in critical server infrastructures; and
  • Advanced Debug and Serviceability: integrated tools and added device flexibility provide a robust system while delivering ease-of-integration and enhanced testability for server OEMs.

Product Availability

RB26 is currently sampling to key potential customers and critical ecosystem partners. This chipset includes a roadmap with value-added features to support further improvements to system performance and reliability.

Rambus will be demonstrating its server DIMM chipset at the Intel Developer Forum, as a Gold Sponsor and participant in the DDR4 Community, happening August 18-20, 2015 at Moscone Center in San Francisco.

For more details about our R+ DDR4 Server DIMM Chipset, please visit rambus.com/dimmchipset.

Follow Rambus

Company website: rambus.com
Rambus blog: rambusblog.com
Twitter: @rambusinc
LinkedIn: www.linkedin.com/company/rambus
Facebook: www.facebook.com/RambusInc

About Rambus Memory and Interfaces Division (MID)

The Rambus Memory and Interfaces Division develops products and services that solve the power, performance, and capacity challenges of the mobile, connected device, and cloud computing markets. Rambus enhanced standards-compatible and custom memory and serial link solutions include chips, architectures, memory and chip-to-chip interfaces, DRAM, IP validation tools, and system and IC design services. Developed through our system-aware design methodology, Rambus products deliver improved time-to-market and first-time-right quality.

About Rambus Inc.

Rambus creates cutting-edge semiconductor and IP products, spanning memory and interfaces to security, smart sensors and lighting. Our chips, customizable IP cores, architecture licenses, tools, services, training and innovations improve the competitive advantage of our customers. We collaborate with the industry, partnering with leading ASIC and SoC designers, foundries, IP developers, EDA companies and validation labs. Our products are integrated into tens of billions of devices and systems, powering and securing diverse applications, including Big Data, Internet of Things (IoT), mobile, consumer and media platforms. At Rambus, we are makers of better. For more information, visit rambus.com.

[i] Registered Dual Inline Memory Modules (RDIMMs) and Load Reduced Dual Inline Memory Modules (LRDIMMs)

Rambus Licenses Patents and Technology Solutions to IBM

Agreements cover use of memory controller and serial link interface technologies

SUNNYVALE, Calif. — March 23, 2015 — Rambus Inc. (NASDAQ:RMBS) today announced it has signed both patent and technology license agreements with IBM. The patent license agreement authorizes IBM to integrate Rambus memory controller and serial link interface technologies. The technology license agreement will have Rambus develop and deliver high-performance memory interface design IP to enhance IBM systems and semiconductor offerings. Specific terms of the agreements are confidential.

Follow Rambus
Company website: rambus.com
Rambus blog: rambusblog.com
Twitter: @rambusinc
LinkedIn: www.linkedin.com/company/rambus
Facebook: www.facebook.com/RambusInc

About Rambus Inc.
Rambus brings invention to market. Our customizable IP cores, architecture licenses, tools, services, and training improve the competitive advantage of our customer’s products while accelerating their time-to-market. Rambus products and innovations capture, secure and move data. For more information, visit rambus.com.