At Rambus, we create cutting-edge semiconductor and IP products, spanning memory and interfaces to security, smart sensors and lighting.
Found 142 Results
Sonics And Northwest Logic Partner On High Throughput Memory Subsytem Solutions
https://www.rambus.com/northwest-logic-sonics-partner-high-throughput-memory-subsytem-solutions/Focus on SOC Designs for Machine Learning, Computer Vision, UHD Video Processing, and Enterprise SSD Applications San Jose, Calif. – May 9, 2017 – Sonics, Inc., the world’s foremost supplier of Network On-Chip (NoC) and power management technologies and services and Northwest Logic, a leading provider of high performance IP cores, today announced their partnership […]
Why HBM2 is all about the PHY
https://www.rambus.com/blogs/why-hbm2-is-all-about-the-phy/Rambus’ Bill Fuller recently penned an article for Semiconductor Engineering about HBM2 DRAM. As Fuller observes, HBM DRAM is currently used in graphics, high-performance computing (HPC), server, networking and client applications. Recent examples of second-generation HBM deployment include NVIDIA’s Quadro GP100 GPU which is paired with 16GB of stacked (through-silicon via) ECC HBM2 (High Bandwidth […]
The rise of high bandwidth memory (HBM)
https://www.rambus.com/blogs/the-rise-of-high-bandwidth-memory-hbm/Semiconductor Engineering’s Ann Steffora Mutschler recently penned an article about high bandwidth memory (HBM). As Mutschler observes, the latest iteration of HBM continues its rise as a viable contender in the memory space. Indeed, HBM is finding its way into leading-edge graphics, networking and high-performance computing systems. High bandwidth memory may also find a role […]
ZDNet highlights Rambus’ role in Samsung’s 14nm tapeout
https://www.rambus.com/blogs/zdnet-highlights-rambus-role-in-samsungs-14nm-tapeout/ZDNet journalist Cho Mu-Hyun reports that Samsung has confirmed a successful network processor tape-out based on the company’s 14LPP (Low-Power Plus) process technology in close collaboration with eSilicon and Rambus. “[Samsung] used its 14 Low-Power Plus process and know-how from network applications together with eSilicon’s ASIC and 2.5D design capability and Rambus’ 28G SerDes solution […]
Samsung and eSilicon tape out 14nm network processor with Rambus 28G SerDes solution
https://www.rambus.com/blogs/samsung-and-esilicon-tape-out-14nm-network-processor-with-rambus-28g-serdes-solution/Samsung Electronics has announced a successful network processor tape-out based on the company’s 14LPP (Low-Power Plus) process technology in close collaboration with eSilicon and Rambus. The tape-out was made possible by Samsung’s cutting-edge foundry process and design infrastructure for network applications, eSilicon’s complex ASIC and 2.5D design capability with its IP solutions, and Rambus’ high-speed […]
Controllers Newsletter – Q1 2017
https://www.rambus.com/controllers-newsletter-q1-2017/Mixel and Northwest Logic Celebrate 28th MIPI Design Win Northwest Logic and Mixel have been collaborating to provide complete MIPI Controller and PHY solutions for almost 8 years. Recently, the companies were awarded their 28th mutual design win. “Mixel is a market leader in MIPI D/C-PHYs with the broadest process support”, stated Ashraf Takla, president […]
Building a robust HBM2 PHY
https://www.rambus.com/blogs/building-a-robust-hbm2-phy/What is HBM? HBM is a high-performance memory that features reduced power consumption and a small form factor. More specifically, it combines 2.5D packaging with a wider interface at a lower clock speed (as compared to DDR4) to deliver higher overall throughput at a higher bandwidth-per-watt efficiency for high-performance computing applications. Originally targeted at the […]
The Rambus HBM GEN2 PHY: A closer look
https://www.rambus.com/blogs/the-rambus-hbm-gen2-phy-a-closer-look/Earlier this week, Rambus announced the availability of its new High Bandwidth Memory (HBM) Gen2 PHY. Designed for systems that require low latency and high bandwidth memory, the Rambus HBM PHY, built on the GLOBALFOUNDRIES advanced 14nm Power Plus (LPP) process technology, is targeted at networking and data center applications. According to Frank Ferro, a […]
Rambus launches High Bandwidth Memory PHY on GLOBALFOUNDRIES 14nm LPP
https://www.rambus.com/blogs/rambus-launches-high-bandwidth-memory-phy-on-globalfoundries-14nm-lpp/Rambus has announced the availability of its High Bandwidth Memory (HBM) Gen2 PHY developed for the GLOBALFOUNDRIES FX-14TM ASIC Platform. Designed for systems that require low latency and high bandwidth memory, the Rambus HBM PHY, built on the GLOBALFOUNDRIES advanced 14nm Power Plus (LPP) process technology, is targeted at networking and data center applications. According to […]
Rambus Introduces High Bandwidth Memory PHY on GLOBALFOUNDRIES FX-14™ ASIC Platform using 14nm LPP Process Technology
https://www.rambus.com/rambus-introduces-high-bandwidth-memory-phy-on-globalfoundries-fx-14-asic-platform-using-14nm-lpp-process-technology/High-performance, power-efficient memory solution designed for today’s data centers SUNNYVALE, Calif. – February 7, 2017 – Rambus Inc. (NASDAQ: RMBS) today announced the availability of its High Bandwidth Memory (HBM) Gen2 PHY developed for GLOBALFOUNDRIES high-performance FX-14TM ASIC Platform. Built on the GLOBALFOUNDRIES 14nm FinFET (14LPP) process technology, the Rambus HBM PHY is aimed at […]
